參數(shù)資料
型號: CWP8-CG
廠商: IXYS Corporation
英文描述: DIODE ZENER SINGLE 200mW 9.1Vz 0.05mA-Izt 0.05 0.1uA-Ir 6.9 SOD-323 3K/REEL
中文描述: 整流二極管
文件頁數(shù): 1/22頁
文件大?。?/td> 765K
代理商: CWP8-CG
1
IXYS reserves the right to change limits, test conditions and dimensions
Contents
Page
Symbols and Definitions
Nomenclature
General Information
Assembly Instructions
FRED, Rectifier Diode and Thyristor Chips in Planar Design
2
2
3
4
5
IGBT Chips
V
CES
I
C
G-Series, Low V
CE(sat)
B2 Types
G-Series, Fast C2 Types
S-Series, SCSOA Capability, Fast Types
E-Series, Improved NPT3 technology
600 ...1200 V
7 ... 20 A
7 ... 20 A
10 ... 20 A
20 ... 150 A
6
6
6
7
600 V
600 V
1200 ... 1700 V
MOSFET Chips
V
DSS
R
DS(on)
HiPerFET
TM
Power MOSFET
PolarHT
TM
MOSFET, very Low R
DS(on)
P-Channel Power MOSFET
N-Channel Depletion Mode MOSFET
70 ...1200 V
55 ... 300 V
-100 ...-600 V
500 ...1000 V
0.005 ... 4.5
0.015 ... 0.135
0.06 ... 1.2
30 ... 110
8-10
11
12
12
Layouts
13-17
Bipolar Chips
V
RRM
/ V
DRM
1200 ... 1800 V
600 ... 1200 V
200 ... 1200 V
600 ... 1800 V
100 ... 600 V
8 ... 200 V
800 ... 2200 V
1600 ... 1800 V
I
F(AV)M
/ I
T(AV)M
12 ... 416 A
8 ... 244 A
9 ... 148 A
12 ... 150 A
3.5 ... 25 A
28 ... 145 A
15 ... 540 A
10 ... 26 A
Rectifier Diodes
FREDs
Low Leakage FREDs
SONIC-FRD
TM
Diodes
GaAs Schottky Diodes
Schottky Diodes
Phase Control Thyristors
Fast Rectifier Diodes
18-19
20-21
22-23
24-25
26-27
28-31
32-33
34
Direct Copper Bonded (DCB), Direct Alu Bonded (DAB) Ceramic Substrates
What is DCB/DAB
DCB Specification
35
36
相關PDF資料
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