參數(shù)資料
型號(hào): CURC307
廠商: Comchip Technology Co., Ltd.
英文描述: RTP, 7-wire, 8.4-in, 1.1mm glass, P/F, 80%, AG5, 46mm tail,
中文描述: 貼片超快速恢復(fù)整流器
文件頁(yè)數(shù): 1/2頁(yè)
文件大小: 68K
代理商: CURC307
Reverse Voltage: 50 - 1000 Volts
Forward Current: 3.0 Amp
CURC301 Thru CURC307
www.comchip.com.tw
COMCHIP
Maximum Ratings and Electrical Characterics
MDS0210015B
Page 1
SMD Ultra Fast Recovery Rectifier
Features
Ideal for surface mount applications
Easy pick and place
Plastic package has Underwriters Lab.
flammability classification 94V-0
Fast recovery time: 50 - 75 nS
Low leakage current
Mechanical data
Case: JEDEC DO-214AB molded plastic
Terminals: solderable per MIL-STD-750,
method 2026
Polarity: Color band denotes cathode
end
Mounting position: Any
Approx. Weight: 0.21 gram
Parameter
Max. Repetitive Peak Reverse Voltage
Max. DC Blocking Voltage
Max. RMS Voltage
Peak Surge Forward Current
8.3ms single half sine-wave
superimposed on rate load
( JEDEC method )
Max. Average Forward Current
Max. Instantaneous Forward Current
at 3.0 A
Reverse recovery time
Max. DC Reverse Current at Rated DC
Blocking Voltage Ta=25
Ta=100
C
Max. Thermal Resistance (Note 1)
Operating Junction Temperature
Storage Temperature
Symbol
V
RRM
V
DC
V
RMS
I
FSM
I o
V
F
Trr
I
R
R
JL
T j
T
STG
Unit
V
V
V
A
A
V
nS
uA
Note 1: Thermal resistance from junction to lead, 8.0x8.0mm square (0.13 mm thick) land areas.
CURC
301
CURC
302
50
50
35
600
600
420
100
100
70
100
3.0
1.0
-55 to +150
15
5.0
100
-55 to +150
CURC
307
CURC
306
CURC
305
CURC
304
CURC
303
800
800
560
400
400
280
200
200
140
1000
1000
700
75
50
C/W
C
C
C
1.3
1.7
SMC/DO-214AB
Dimensions in inches and (millimeter)
0.008(0.20)
0.0203(0.10)
0.124(3.15)
0.108(2.75)
0.103(2.62)
0.079(2.00)
0.050(1.27)
0.030(0.76)
0.245(6.22)
0.220(5.59)
0.280(7.11)
0.260(6.60)
0.012(0.31)
0.006(0.15)
0.320(8.13)
0.305(7.75)
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