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FN2950.3
April 26, 2006
Die Characteristics
DIE DIMENSIONS:
178.7 x 187.0 x 19
±1mils
METALLIZATION:
Type: Silicon - Aluminum
Thickness: 11k
±2k
GLASSIVATION:
Type: Nitrox
Thickness: 10k
WORST CASE CURRENT DENSITY:
2.07 x 104 A/cm2
Metallization Mask Layout
82C52
D0
SD1
INTR
TBRE
CO
D1
CTS
GND
IX
WR
RD
CSO
VCC
DR
RST
RTS
DTR
DSR
SDO
OX
D2
D3
D4
D5
D6
D7
A0
A1
82C52
