
www.vishay.com
9
CRA06P
Vishay Dale
Document Number 31047
Revision 25-Jul-05
For Technical Questions, contact: ff3aresistors@vishay.com
DIMENSIONS
Thick Film, Resistor Array
4-Resistor Device
A
C
w
T
B
P
L
DIMENSIONS [in millimeters]
L
ABC
P
T
W
8
3.20
0.30
0.40
0.80
0.60
1.6
Tol
± 0.20 ± 0.20 ± 0.15 ± 0.20
-
± 0.10 ± 0.15
SOLDER PAD DIMENSIONS [in millimeters]
cw
p
a
b
WAVE
0.8
2.6
0.8
0.4
0.9
c
b
p
a
w
DESCRIPTION
Production is strictly controlled and follows a set of instructions
established for reproducibility. A thick film layer is deposited
on a high grade ceramic substrate. The resistor elements are
covered by a protective coating designed for electrical,
mechanical and climatic protection. The wrap around
terminations receive a final pure tin on nickel plating.
The result of the determined production is verified by an
extensive testing procedure. Only accepted products are laid
directly into the paper tape in accordance with EIA 481.
ASSEMBLY
The resistors are suitable for processing on automatic SMD
assembly systems. They are suitable for automatic soldering
using wave and solder paste reflow. Due to the design, arrays
have automatic placement capability. The resistors are Lead
(Pb)-free, the pure tin plating provides compatibility with Lead
(Pb)-free and Lead-containing soldering processes. All
products comply with the CEFIC-EECA-EICTA list of legal
restrictions on hazardous substances.
This includes full compatibility with the following directives:
2000/53/EC End of Vehicle Life Directive (ELV)
2000/53/EC Annex II to End of Vehicle Life Directive (ELV II)
2002/95/EC Restriction of the use of Hazardous
Substances Directive (RoHS)
2002/96/EC Waste Electrical and Electronic Equipment
Directive (WEEE)
Solderability is specified for 2 years after production or re-
qualification. The permitted storage time is 20 years.
PIN
NO#