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參數(shù)資料
| 型號： | CM3004-25SF |
| 廠商： | California Micro Devices Corporation |
| 英文描述： | 1.0 Amp Dual Mode Low-Dropout CMOS Regulator |
| 中文描述： | 1.0安培雙模式低壓差穩(wěn)壓器的CMOS |
| 文件頁數(shù)： | 7/9頁 |
| 文件大?。?/td> | 211K |
| 代理商： | CM3004-25SF |
2005 California Micro Devices Corp. All rights reserved.
01/10/05
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
7
CM3004
PRELIMINARY
Performance Information (cont’d)
CM3004 Typical Thermal Characteristics
The overall junction to ambient thermal resistance
(
θ
JA
) for device power dissipation (PD) consists prima-
rily of two paths in series. The first path is the junction
to the case (
θ
JC
) which is defined by the package
style, and the second path is case to ambient (
θ
CA
)
thermal resistance which is dependent on board lay-
out. The final operating junction temperature for any
set of conditions can be estimated by the following
thermal equation:
T
JUNC
= T
AMB
+ P
D
(
θ
JC
) + P
D
(
θ
CA
)
= T
AMB
+ P
D
(
θ
JA
)
The CM3004 uses a thermally enhanced package
where all the GND pins (5 through 8) are integral to the
leadframe. When this package is mounted on a double
sided printed circuit board with two square inches of
copper allocated for "heat spreading", the resulting
θ
JA
is about 50°C/W.
Based on a typical operating power dissipation of 1.0W
with an ambient of 85°C, the resulting junction temper-
ature will be:
T
JUNC
= T
AMB
+ P
D
(
θ
JA
)
= 85°C + 1.0W (50°C/W)
= 85°C + 50°C = 135°C
Thermal characteristics were measured using a double
sided board with two square inches of copper area
connected to the GND pins for "heat spreading". Mea-
surement was performed under light load conditions
(5mA).
Temperature vs. Output Voltage (1.2V)
1.15
1.17
1.19
1.21
1.23
1.25
-40
25
85
Temperature ('C)
O
Temperature vs. Output Voltage ( 2.5V )
2.40
2.45
2.50
2.55
2.60
-40
-25
0
25
50
75
85
100
125
150
Temperature ('C)
O
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