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參數(shù)資料
| 型號： | CM3002-25SA |
| 廠商： | California Micro Devices Corporation |
| 英文描述： | Micropower 1.0A Low Dropout CMOS Regulators |
| 中文描述： | 微安培的CMOS低壓差穩(wěn)壓器 |
| 文件頁數(shù)： | 14/17頁 |
| 文件大?。?/td> | 352K |
| 代理商： | CM3002-25SA |
2004 California Micro Devices Corp. All rights reserved.
14
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲
Tel: 408.263.3214
▲
Fax: 408.263.7846
▲
www.calmicro.com
08/16/04
CM3002
Performance Information (cont’d)
Typical Thermal Characteristics
The overall junction to ambient thermal resistance
(
θ
JA
) for device power dissipation (P
D
) consists prima-
rily of two paths in series. The first path is the junction
to the case (
θ
JC
) which is defined by the package style,
and the second path is case to ambient (
θ
CA
) thermal
resistance which is dependent on board layout. The
final operating junction temperature for any set of con-
ditions can be estimated by the following thermal equa-
tion:
T
JUNC
= T
AMB
+ P
D
(
θ
JC
) + P
D
(
θ
CA
)
= T
AMB
+ P
D
(
θ
JA
)
The CM3002 family uses thermally enhanced SOIC
and MSOP packages where all the GND pins (5
through 8) are integral to the leadframe. When this
package is mounted on a double sided printed circuit
board with two square inches of copper allocated for
“heat spreading”, the resulting
θ
JA
is about 5
0°
C/W for
the SOIC package and
70
°
C/W for the MSOP pack-
age
.
Based on a maximum power dissipation of 0.8W (Load
x Vin-Vout = 1.0A x [3.3V-2.5V]) with an ambient of
70
°
C, the resulting junction temperature for a SOIC-
packaged device will be:
T
JUNC
= T
AMB
+ P
D
(
θ
JA
)
= 70
°
C + 0.8W
(50
°
C/W)
= 70
°
C + 40
°
C = 110
°
C
Thermal characteristics were measured using a double
sided board with two square inches of copper area
connected to the
GND
pins for “heat spreading”.
Measurements showing performance up to a junction
temperature of 125
°
C are presented in
Figure 1
,
Figure 2
,
Figure 3
and
Figure 4
. They were performed
under light load conditions (5mA); this allows the ambi-
ent temperature to be representative of the internal
junction temperature.
Note:
The use of multi-layer board construction with
separate ground and power planes will further enhance
the overall thermal performance. In the event of no
copper area being dedicated for heat spreading, a
multi-layer board construction using only the minimum
size pad layout will typically provide a CM3002 device
packaged in a SOIC package with an overall
θ
JA
of
50
°
C/W, which allows up to 0.8W to be dissipated
safely.
Please consult CAMD Technical Support for assistance
with thermal analysis of the CM3002 family of regula-
tors with respect to a specific application.
Figure 1. CM3002-15SA/SF Performance vs. Temperature
Output Voltage with Temperature (5mA Load)
1.46
1.48
1.50
1.52
1.54
0
25
50
75
100
V
Ground Current with Temperature (No Load)
0
100
200
300
400
500
600
700
0
25
50
75
100
125
G
Junction Temperature [°C]
Junction Temperature [°C]
125
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| CM3002-25SF | Micropower 1.0A Low Dropout CMOS Regulators |
| CM3002-33MA | Micropower 1.0A Low Dropout CMOS Regulators |
| CM3002-33MF | Micropower 1.0A Low Dropout CMOS Regulators |
| CM3002-33SA | Micropower 1.0A Low Dropout CMOS Regulators |
| CM3002-33SF | Micropower 1.0A Low Dropout CMOS Regulators |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| CM3002-25SF | 制造商:CALMIRCO 制造商全稱:California Micro Devices Corp 功能描述:Micropower 1.0A Low Dropout CMOS Regulators |
| CM3002-33 | 制造商:CALMIRCO 制造商全稱:California Micro Devices Corp 功能描述:Micropower 1.0A Low Dropout CMOS Regulators |
| CM3002-33MA | 制造商:CALMIRCO 制造商全稱:California Micro Devices Corp 功能描述:Micropower 1.0A Low Dropout CMOS Regulators |
| CM3002-33MF | 制造商:CALMIRCO 制造商全稱:California Micro Devices Corp 功能描述:Micropower 1.0A Low Dropout CMOS Regulators |
| CM3002-33SA | 制造商:CALMIRCO 制造商全稱:California Micro Devices Corp 功能描述:Micropower 1.0A Low Dropout CMOS Regulators |
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