| 型號(hào): | CIM039A3 |
| 廠商: | MOLEX INC |
| 元件分類: | 接線盒 |
| 英文描述: | 9 A, MODULAR TERMINAL BLOCK, 1 ROW, 1 DECK |
| 文件頁數(shù): | 2/2頁 |
| 文件大小: | 108K |
| 代理商: | CIM039A3 |

相關(guān)PDF資料 |
PDF描述 |
|---|---|
| CIM040M7 | 9 A, MODULAR TERMINAL BLOCK, 1 ROW, 1 DECK |
| CIM049P6 | 9 A, MODULAR TERMINAL BLOCK, 1 ROW, 1 DECK |
| CIM050A1 | 9 A, MODULAR TERMINAL BLOCK, 1 ROW, 1 DECK |
| CIF10A01 | 9 A, MODULAR TERMINAL BLOCK, 1 ROW, 1 DECK |
| CIF11AM7 | 9 A, MODULAR TERMINAL BLOCK, 1 ROW, 1 DECK |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| CIM03J121 | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:Chip Bead CIB/CIM Series For EMI Suppression |
| CIM03J121NC | 制造商:Samsung Electro-Mechanics 功能描述:- Tape and Reel 制造商:Samsung Electro-Mechanics 功能描述:FERRITE CHIP 120 OHM 200MA 0201 制造商:Samsung Semiconductor 功能描述:CIM Series 0201 120 Ohm 200 mA 0.8 DCR Surface Mount Ferrite Bead |
| CIM03J241 | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:Chip Bead ; CIB/CIM Series For EMI Suppression |
| CIM03N300 | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:Chip Bead ; CIB/CIM Series For EMI Suppression |
| CIM03N300NC | 制造商:Samsung Electro-Mechanics 功能描述:- Tape and Reel 制造商:Samsung Electro-Mechanics 功能描述:FERRITE CHIP 30 OHM 150MA 0201 制造商:Samsung Semiconductor 功能描述:CIM Series 0201 30 Ohm 150 mA 0.8 DCR Surface Mount Ferrite Bead |