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參數(shù)資料
| 型號： | CDR02BX101BDSP |
| 廠商： | KEMET Corporation |
| 元件分類： | 電容 |
| 英文描述： | CERAMIC CHIP/MIL-PRF-55681 |
| 中文描述： | 陶瓷芯片/mil-prf-55681 |
| 文件頁數(shù)： | 8/10頁 |
| 文件大?。?/td> | 949K |
| 代理商： | CDR02BX101BDSP |
KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
Embossed Carrier Tape Configuration (cont.)
Sketch D:
Tape Camber (Top View)
Allowable camber to be 1 mm/250 mm.
250mm (9.843)
1mm (0.039) Max.
1mm (0.039) Max.
Table 2 – REEL DIMENSIONS (Metric will govern)
Figure 3:
Reel Dimensions (Metric Dimensions will govern)
Tape Size
8 mm
A Max
330.0
(12.992)
B* Min
1.5
(0.059)
C
D* Min
20.2
(0.795)
N Min
50.0
(1.969)
See
Note 3
Table 1
W
1
8.4
W
2
Max
14.4
(0.567)
W
3
13.0 ± 0.20
(0.512 ± 0.008)
7.9 Min
(0.311)
10.9 Max
(0.429)
11.9 Min
(0.469)
15.4 Max
(0.606)
+1.5, -0.0
(0.331
+0.059, -0.0)
12.4
+2.0, -0.0
(0.488
+0.078, -0.0)
12 mm
330.0
(12.992)
1.5
13.0 ± 0.20
(0.512 ± 0.008)
20.2
(0.795)
18.4
(0.724)
(0.059)
TANTALUM, CERAMIC AND
ALUMINUM CHIP CAPACITORS
Packaging Information
Figure 2:
Tape Leader
& Trailer
Dimensions
(Metric
Dimensions
Will Govern)
400mm (15.75) Min.
20°
95
P
相關PDF資料 |
PDF描述 |
|---|---|
| CDR02BX101BDSR | CERAMIC CHIP/MIL-PRF-55681 |
| CDR02BX101BDUM | CERAMIC CHIP/MIL-PRF-55681 |
| CDR02BX101BDUP | CERAMIC CHIP/MIL-PRF-55681 |
| CDR02BX101BDUR | CERAMIC CHIP/MIL-PRF-55681 |
| CDR02BX101BDWM | CERAMIC CHIP/MIL-PRF-55681 |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| CDR02BX101BDSR | 制造商:KEMET 制造商全稱:Kemet Corporation 功能描述:CERAMIC CHIP/MIL-PRF-55681 |
| CDR02BX101BDUM | 制造商:KEMET 制造商全稱:Kemet Corporation 功能描述:CERAMIC CHIP/MIL-PRF-55681 |
| CDR02BX101BDUP | 制造商:KEMET 制造商全稱:Kemet Corporation 功能描述:CERAMIC CHIP/MIL-PRF-55681 |
| CDR02BX101BDUR | 制造商:KEMET 制造商全稱:Kemet Corporation 功能描述:CERAMIC CHIP/MIL-PRF-55681 |
| CDR02BX101BDWM | 制造商:KEMET 制造商全稱:Kemet Corporation 功能描述:CERAMIC CHIP/MIL-PRF-55681 |
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