參數(shù)資料
型號: CD826A
廠商: Microsemi Corporation
英文描述: MONOLITHIC TEMPERATURE COMPENSATED ZENER REFERENCE CHIPS
中文描述: 整體式溫補穩(wěn)壓參考切片
文件頁數(shù): 1/2頁
文件大?。?/td> 293K
代理商: CD826A
177
MAXIMUM RATINGS
Operating Temperature: -65°C to +175°C
Storage Temperature: -65°C to +175°C
REVERSE LEAKAGE CURRENT
l
R
= 2
μ
A @ 25°C & VR= 3 Vdc
ELECTRICAL CHARACTERISTICS
@ 25°C, unless otherwise specified.
-55° TO +100°
CDI
TYPE
NUMBER
ZENER ZENER MAXIMUM VOLTAGE
VOLTAGE
TEST
CURRENT
VZT@ I ZT
EFFECTIVE
TEMPERATURE
COEFFICIENT
ZENER
IMPEDANCE
ZZT
TEMPERATURE
STABILITY
3VZT
I ZT
(Note 1)
(Note 2)
VOLTS
mA
OHMS
mV
% / °C
CD821
CD821A
CD823
CD823A
CD825
CD825A
CD826
CD827
CD827A
CD828
CD829
CD829A
5.9 - 6.5
5.9 - 6.5
5.9 - 6.5
5.9 - 6.5
5.9 - 6.5
5.9 - 6.5
5.9 - 6.5
5.9 - 6.5
5.9 - 6.5
6.2 - 6.9
5.9 - 6.5
5.9 - 6.5
7.5
7.5
7.5
7.5
7.5
7.5
7.5
7.5
7.5
7.5
7.5
7.5
15
10
15
10
15
10
15
15
10
15
15
10
96
96
48
48
19
19
20
9
9
10
5
5
0.01
0.01
0.005
0.005
0.002
0.002
0.002
0.001
0.001
0.001
0.0005
0.0005
NOTE 1
Zener impedance is derived by superimposing on lZTA 60Hz rms a.c.
current equal to 10% of lZT.
NOTE 2
The maximum allowable change observed over the entire temperature
range i.e.,the diode voltage will not exceed the specified mV at any
discrete temperature between the established limits, per JEDEC
standard No.5.
Backside is not cathode
and must be electrically isolated
T = Metallization Test Pad
DESIGN DATA
METALLIZATION:
Top: C (Cathode) ..................Al
A (Anode) ..................... Al
Back: .......................................Au
AL THICKNESS
.........25,000
Min
GOLD THICKNESS
......4,000
Min
CHIP THICKNESS
...............10 Mils
CIRCUIT LAYOUT DATA:
Backside must be electrically
isolated.
Backside is not cathode.
For Zener operation cathode must
be operated positive with respect
to anode.
TOLERANCES:
ALL
Dimensions + 2 mils
1N821 THRU 1N829 AVAILABLE IN
JANHC AND JANKC
PER MIL-PRF-19500/159
MONOLITHIC TEMPERATURE COMPENSATED ZENER REFERENCE CHIPS
ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE
ELECTRICALLY EQUIVALENT TO 1N821 THRU 1N829
COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES,
WITH THE EXCEPTION OF SOLDER REFLOW
CD821
thru
CD829A
2
6 LAKE STREET, LAWRENCE, MASSACHUSETTS 01841
PHONE (978) 620-2600
WEBSITE: http://www.microsemi.com
FAX (978) 689-0803
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