參數(shù)資料
型號: CD74HCT21M96G4
廠商: Texas Instruments
文件頁數(shù): 12/14頁
文件大小: 0K
描述: IC DUAL 4-IN AND GATE 14 SOIC
標準包裝: 2,500
系列: 74HCT
邏輯類型: 與門
電路數(shù): 2
輸入數(shù): 4
電源電壓: 4.5 V ~ 5.5 V
電流 - 靜態(tài)(最大值): 2µA
輸出電流高,低: 4mA,4mA
邏輯電平 - 低: 0.8V
邏輯電平 - 高: 2V
額定電壓和最大 CL 時的最大傳播延遲: 27ns @ 4.5V,50pF
工作溫度: -55°C ~ 125°C
安裝類型: 表面貼裝
供應(yīng)商設(shè)備封裝: 14-SOIC
封裝/外殼: 14-SOIC(0.154",3.90mm 寬)
包裝: 帶卷 (TR)
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com
15-Oct-2009
Addendum-Page 2
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