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參數(shù)資料
| 型號： | CCR11.0MXC8T |
| 元件分類： | 陶瓷諧振器 |
| 英文描述： | CERAMIC RESONATOR, 11 MHz |
| 封裝： | ROHS COMPLIANT, SMD, 3 PIN |
| 文件頁數(shù)： | 6/6頁 |
| 文件大?。?/td> | 103K |
| 代理商： | CCR11.0MXC8T |
(6/6)
004-03 / 20080220 / ef31_ccr.fm
All specifications are subject to change without notice.
OSCILLATING FREQUENCY-TEMPERATURE
CHARACTERISTIC MEASURING CIRCUIT
MUC8/MXC8 TYPE 4.0 to 9.99MHz
MXC8 TYPE 10.0 to 11.0MHz
MXC7 TYPE 16.0 to 50.0MHz
MX7 TYPE 16.0 to 50.0MHz
MYC7 TYPE 24.0 to 50.0MHz
RELIABILITY AND TEST CONDITIONS
The following test items are satisfied.
(1) Oscillating frequency change: Within ±0.25%
(2) Resonant resistance change: Within ±10
(3) Appearance; serious abnormalities not to exist.
Vcc
Fosc
Vcc: 5V
Rf: 1M
IC: TC4089UBP(TOSHIBA)
Rf
Vcc
Fosc
Rf
Rd
Vcc: 5V
Rf: 1M
IC: TC74HCU04(TOSHIBA)
Rd: 220
Vcc
Fosc
Vcc: 5V
Rf: 1M
IC: TC74HCU04(TOSHIBA)
Rf
Vcc
Fosc
Vcc: 5V
Rf: 1M
IC: TC74HCU04 (TOSHIBA)
Rf
Vcc
Fosc
Rf
Rd
Vcc: 5V
Rf: 1M
IC: TC74HCU04(TOSHIBA)
Rd: 680
Test items
Test conditions
Low temperature storage
Temperature: –40±3°C
Time: 1000h
High temperature storage
Temperature: +85±2°C
Time: 1000h
Loading humidity resistance
Humidity: 90 to 95(%)RH
Temperature: 60±2°C
Time: 1000h
Thermal shock
–40°C (30min), 85°C (30min) x 100 cycles
Soldering heat resistance
Solder temperature: peak 260°C, 10s
reflow
Drop
Drop 3 times onto the concrete from a
height of 1m
Vibration
Frequency: 10
55 10Hz/min
Amplitude: 1.5mm
X, Y and Z directions for 2h each
Board bend test
Solder this product onto a glass epoxy
board (L100
× W40× T1.6mm), press it by
up to 1mm in 1mm/s and keep it for 5sec.
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