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參數(shù)資料
| 型號： | CBTW28DD14ET |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 編、解碼器及復(fù)用、解復(fù)用 |
| 英文描述： | 14-bit bus switch-multiplexer for DDR2-DDR3 applications |
| 中文描述： | MULTIPLEXER, PBGA48 |
| 封裝： | 4.50 X 4.50 MM, 0.80 MM PITCH, 0.50 MM PITCH, GREEN, PLASTIC, SOT1155-1, TFBGA-48 |
| 文件頁數(shù)： | 11/12頁 |
| 文件大?。?/td> | 267K |
| 代理商： | CBTW28DD14ET |
CBTW28DD14
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 20 July 2010
8 of 12
NXP Semiconductors
CBTW28DD14
14-bit bus switch/multiplexer for DDR2-DDR3 applications
13.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 5) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 8 and 9
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 5.
Table 8.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
Table 9.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
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| CBTW28DD14ET,118 | 功能描述:多路器開關(guān) IC 2.5GHz 2V 0.3mA 80ps RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 開關(guān)數(shù)量:4 開啟電阻（最大值）:7 Ohms 開啟時間（最大值）: 關(guān)閉時間（最大值）: 傳播延遲時間:0.25 ns 工作電源電壓:2.3 V to 3.6 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:UQFN-16 |
| CBTWF060C0 | 功能描述:斷路器 6 A White / I-0 RoHS:否 制造商:Phoenix Contact 產(chǎn)品:Device Circuit Breakers 產(chǎn)品類型:Thermomagnetic 電流額定值:2 A 電壓額定值 AC:240 V, 277 V 電壓額定值 DC:50 V 極數(shù):1 Pole 執(zhí)行器類型:Slide 電路功能:Trip Free 系列:CB TM1 工作溫度范圍:- 30 C to + 60 C 照明:No |
| CBTWF080C0 | 功能描述:斷路器 8 A White / I-0 RoHS:否 制造商:Phoenix Contact 產(chǎn)品:Device Circuit Breakers 產(chǎn)品類型:Thermomagnetic 電流額定值:2 A 電壓額定值 AC:240 V, 277 V 電壓額定值 DC:50 V 極數(shù):1 Pole 執(zhí)行器類型:Slide 電路功能:Trip Free 系列:CB TM1 工作溫度范圍:- 30 C to + 60 C 照明:No |
| CBTWF100C0 | 功能描述:斷路器 10 A White / I-0 RoHS:否 制造商:Phoenix Contact 產(chǎn)品:Device Circuit Breakers 產(chǎn)品類型:Thermomagnetic 電流額定值:2 A 電壓額定值 AC:240 V, 277 V 電壓額定值 DC:50 V 極數(shù):1 Pole 執(zhí)行器類型:Slide 電路功能:Trip Free 系列:CB TM1 工作溫度范圍:- 30 C to + 60 C 照明:No |
| CBTWF130C0 | 制造商:Schurter Electronic Components 功能描述:CBE TA35-CBTWF130C0 - Bulk |
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