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參數(shù)資料
| 型號： | CBTL04083ABS |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類： | PCI/cPCI/PXI |
| 英文描述： | 3.3 V, 4 differential channel, 2 : 1 multiplexer-demultiplexer switch for PCI Express Gen3 |
| 封裝： | CBTL04083ABS<SOT1144-1 (HVQFN42)|<<http://www.nxp.com/packages/SOT1144-1.html<1<Always Pb-free,;CBTL04083BBS<SOT1144-1 (HVQFN42)|<<http://www.nxp.com/packages/SOT1144-1.h |
| 文件頁數(shù)： | 5/18頁 |
| 文件大?。?/td> | 437K |
| 代理商： | CBTL04083ABS |
CBTL04083A_CBTL04083B
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 3 — 24 August 2011
13 of 18
NXP Semiconductors
CBTL04083A; CBTL04083B
3.3 V, 4 differential channel, 2 : 1 MUX/deMUX switch for PCIe Gen3
15.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 8) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 10 and 11
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 8.
Table 10.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
C)
Volume (mm3)
< 350
350
< 2.5
235
220
2.5
220
Table 11.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| CBTL04083ABS,518 | 功能描述:編碼器、解碼器、復(fù)用器和解復(fù)用器 3.3V WD BW 4 DIFF CH 2:1 MULTI/DEMUX SW RoHS:否 制造商:Micrel 產(chǎn)品:Multiplexers 邏輯系列:CMOS 位數(shù): 線路數(shù)量（輸入/輸出）:2 / 12 傳播延遲時間:350 ps, 400 ps 電源電壓-最大:2.625 V, 3.6 V 電源電壓-最小:2.375 V, 3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-44 封裝:Tray |
| CBTL04083ABS,558 | 制造商:NXP Semiconductors 功能描述:CBTL04083ABS/HVQFN42/REEL13DPS// - Tape and Reel |
| CBTL04083BBS | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:CBTL04083A/B is a 4 differential channel, 2-to-1 multiplexer/demultiplexer switch for PCI Express Generation 3 (Gen3) applications. |
| CBTL04083BBS,518 | 功能描述:編碼器、解碼器、復(fù)用器和解復(fù)用器 3.3V WD BW 4 DIFF CH 2:1 MULTI/DEMUX SW RoHS:否 制造商:Micrel 產(chǎn)品:Multiplexers 邏輯系列:CMOS 位數(shù): 線路數(shù)量（輸入/輸出）:2 / 12 傳播延遲時間:350 ps, 400 ps 電源電壓-最大:2.625 V, 3.6 V 電源電壓-最小:2.375 V, 3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-44 封裝:Tray |
| CBTL04083BBS,558 | 功能描述:編碼器、解碼器、復(fù)用器和解復(fù)用器 2:1 MUX/DEMUX 3.3V RoHS:否 制造商:Micrel 產(chǎn)品:Multiplexers 邏輯系列:CMOS 位數(shù): 線路數(shù)量（輸入/輸出）:2 / 12 傳播延遲時間:350 ps, 400 ps 電源電壓-最大:2.625 V, 3.6 V 電源電壓-最小:2.375 V, 3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-44 封裝:Tray |
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