參數(shù)資料
型號(hào)： CBTL02043ABQ
廠商： NXP SEMICONDUCTORS
元件分類： 編、解碼器及復(fù)用、解復(fù)用
英文描述： 3.3 V, 2 differential channel, 2 : 1 multiplexer-demultiplexer switch for PCI Express Gen3
中文描述： MULTIPLEXER AND DEMUX/DECODER, PQCC20
封裝： 2.50 X 4.50 MM, 0.85 MM PITCH, PLASTIC, DHVQFN-20
文件頁(yè)數(shù)： 4/16頁(yè)
文件大?。?/td> 202K
代理商： CBTL02043ABQ
CBTL02043A_CBTL02043B
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 1 — 10 March 2011
12 of 16
NXP Semiconductors
CBTL02043A; CBTL02043B
3.3 V, 2 differential channel, 2 : 1 MUX/deMUX switch for PCIe Gen3
15.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 9) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 9 and 10
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 9.
Table 9.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
Table 10.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
CBTL02043ABQ,115 功能描述:多路器開(kāi)關(guān) IC 3.3V 2 DIFF CH 2:1 MULTI/DEMUX SW RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 開(kāi)關(guān)數(shù)量:4 開(kāi)啟電阻（最大值）:7 Ohms 開(kāi)啟時(shí)間（最大值）: 關(guān)閉時(shí)間（最大值）: 傳播延遲時(shí)間:0.25 ns 工作電源電壓:2.3 V to 3.6 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:UQFN-16
CBTL02043B 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:3.3 V, 2 differential channel, 2 : 1 multiplexer/demultiplexer switch for PCI Express Gen3
CBTL02043BBQ 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:3.3 V, 2 differential channel, 2 : 1 multiplexer/demultiplexer switch for PCI Express Gen3
CBTL02043BBQ,115 功能描述:多路器開(kāi)關(guān) IC 3.3V 2 DIFF CH 2:1 MULTI/DEMUX SW RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 開(kāi)關(guān)數(shù)量:4 開(kāi)啟電阻（最大值）:7 Ohms 開(kāi)啟時(shí)間（最大值）: 關(guān)閉時(shí)間（最大值）: 傳播延遲時(shí)間:0.25 ns 工作電源電壓:2.3 V to 3.6 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:UQFN-16
CBTL02043BBQ115 制造商:NXP 功能描述: 制造商:NXP Semiconductors 功能描述:
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