參數(shù)資料
型號: CBT3253APW
廠商: NXP Semiconductors N.V.
元件分類: 開關(guān)
英文描述: Dual 1-of-4 FET multiplexer-demultiplexer
中文描述: 雙四選一場效應(yīng)管復(fù)用器/解復(fù)用器
封裝: CBT3253AD<SOT109-1 (SO16)|<<http://www.nxp.com/packages/SOT109-1.html<1<Always Pb-free,;CBT3253AD<SOT109-1 (SO16)|<<http://www.nxp.com/packages/SOT109-1.html<1<Alwa
文件頁數(shù): 5/17頁
文件大?。?/td> 103K
代理商: CBT3253APW
CBT3253A_2
NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 — 8 February 2007
13 of 17
NXP Semiconductors
CBT3253A
Dual 1-of-4 FET multiplexer/demultiplexer
13.4 Reow soldering
Key characteristics in reow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reow process usually leads to
higher minimum peak temperatures (see Figure 13) than a PbSn process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reow temperature prole; this prole includes preheat, reow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classied in accordance with
Table 9 and 10
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reow
soldering, see Figure 13.
Table 9.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
Table 10.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
相關(guān)PDF資料
PDF描述
CBT3253AD Dual 1-of-4 FET multiplexer-demultiplexer
CBT3253ADB Dual 1-of-4 FET multiplexer-demultiplexer
CBT3253ADS Dual 1-of-4 FET multiplexer-demultiplexer
CBT3257AD Quad 1-of-2 multiplexer-demultiplexer
CBT3257ADB Quad 1-of-2 multiplexer-demultiplexer
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
CBT3253APW,112 功能描述:編碼器、解碼器、復(fù)用器和解復(fù)用器 DUAL1OF4 FET RoHS:否 制造商:Micrel 產(chǎn)品:Multiplexers 邏輯系列:CMOS 位數(shù): 線路數(shù)量(輸入/輸出):2 / 12 傳播延遲時(shí)間:350 ps, 400 ps 電源電壓-最大:2.625 V, 3.6 V 電源電壓-最小:2.375 V, 3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-44 封裝:Tray
CBT3253APW,118 功能描述:編碼器、解碼器、復(fù)用器和解復(fù)用器 DUAL1OF4 FET RoHS:否 制造商:Micrel 產(chǎn)品:Multiplexers 邏輯系列:CMOS 位數(shù): 線路數(shù)量(輸入/輸出):2 / 12 傳播延遲時(shí)間:350 ps, 400 ps 電源電壓-最大:2.625 V, 3.6 V 電源電壓-最小:2.375 V, 3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-44 封裝:Tray
CBT3253APW-T 功能描述:編碼器、解碼器、復(fù)用器和解復(fù)用器 DUAL1OF4 FET MULTIPLEXER/DEMUX RoHS:否 制造商:Micrel 產(chǎn)品:Multiplexers 邏輯系列:CMOS 位數(shù): 線路數(shù)量(輸入/輸出):2 / 12 傳播延遲時(shí)間:350 ps, 400 ps 電源電壓-最大:2.625 V, 3.6 V 電源電壓-最小:2.375 V, 3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-44 封裝:Tray
CBT3253D 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Dual 1-of-4 FET multiplexer/demultiplexer
CBT3253D,112 功能描述:CBT3253D/SOT109/SO16 制造商:nexperia usa inc. 系列:* 零件狀態(tài):在售 標(biāo)準(zhǔn)包裝:50