參數(shù)資料
型號: CBT3244APW,118
廠商: NXP SEMICONDUCTORS
元件分類: 總線收發(fā)器
英文描述: Octal bus switch with quad output enables - # of Bits per Enable: 4 ; Description: Bus Switch ; Flow Through Pinout: yes ; Number of bits: 8 ; Operating temperature: -40~85 Cel; Operating voltage: 4.5~5.5 VDC; Package: SOT360-1 (TSSOP20); Container: Reel Pack, SMD, 13"
中文描述: 3244 SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, PDSO20
封裝: 4.40 MM, PLASTIC, MO-153, SOT-360-1, TSSOP-20
文件頁數(shù): 8/18頁
文件大?。?/td> 109K
代理商: CBT3244APW,118
9397 750 13362
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 02 — 15 September 2005
16 of 18
Philips Semiconductors
CBT3244A
Octal bus switch with quad output enables
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
denitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is denitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8]
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on ex foil. However, the image sensor package can be mounted by the client on a ex foil by
using a hot bar soldering process. The appropriate soldering prole can be provided on request.
[9]
Hot bar soldering or manual soldering is suitable for PMFP packages.
14. Abbreviations
15. Revision history
Table 10:
Abbreviations
Acronym
Description
CDM
Charged Device Model
ESD
ElectroStatic Discharge
HBM
Human Body Model
MM
Machine Model
PRR
Pulse Rate Repetition
TTL
Transistor-Transistor Logic
Table 11:
Revision history
Document ID
Release date
Data sheet status
Change notice
Doc. number
Supersedes
CBT3244_2
20050915
Product data sheet
-
9397 750 13362
CBT3244A_1
Modications:
The format of this data sheet has been redesigned to comply with the new presentation and
information standard of Philips Semiconductors.
added DHVQFN20 package option (affects Section 2 “Features”, Section 3 “Ordering
Section 2 “Features” on page 1, 6th bullet: changed from ‘exceeds 1000 V HBM ...’ to ‘exceeds
2000 V HBM ...’
CBT3244A_1
20040526
Product data sheet
-
9397 750 13281
-
相關(guān)PDF資料
PDF描述
CBT3245ABQ,115 Octal bus switch; Package: SOT764-1 (DHVQFN20); Container: Reel Pack, SMD, 7"
CBT3245ADS,112 Octal bus switch - # of Bits per Enable: 8 ; Description: Bus Switch ; Flow Through Pinout: yes ; Number of bits: 8 ; Operating temperature: -40~85 Cel; Operating voltage: 4.5~5.5 VDC; Package: SOT724-1 (SSOP20); Container: Tube
CBT3245ADS,118 Octal bus switch - # of Bits per Enable: 8 ; Description: Bus Switch ; Flow Through Pinout: yes ; Number of bits: 8 ; Operating temperature: -40~85 Cel; Operating voltage: 4.5~5.5 VDC; Package: SOT724-1 (SSOP20); Container: Reel Pack, SMD, 13"
CBT3245APW,112 Octal bus switch - # of Bits per Enable: 8 ; Description: Bus Switch ; Flow Through Pinout: yes ; Number of bits: 8 ; Operating temperature: -40~85 Cel; Operating voltage: 4.5~5.5 VDC; Package: SOT360-1 (TSSOP20); Container: Tube
CBT3245APW,118 Octal bus switch - # of Bits per Enable: 8 ; Description: Bus Switch ; Flow Through Pinout: yes ; Number of bits: 8 ; Operating temperature: -40~85 Cel; Operating voltage: 4.5~5.5 VDC; Package: SOT360-1 (TSSOP20); Container: Reel Pack, SMD, 13"
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