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參數(shù)資料
| 型號： | CAT34AC02ZE-TE13 |
| 元件分類： | PROM |
| 英文描述： | 256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8 |
| 封裝： | LEAD AND HALOGEN FREE, MSOP-8 |
| 文件頁數(shù)： | 3/10頁 |
| 文件大小： | 68K |
| 代理商： | CAT34AC02ZE-TE13 |
CAT34AC02
2
Doc. No. 1025, Rev. E
D.C. OPERATING CHARACTERISTICS
VCC = +1.8V to +6.0V, unless otherwise specified.
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
ICC
Power Supply Current (Read)
fSCL = 100 kHz
1
mA
ICC
Power Supply Current (Write)
fSCL = 100 kHz
3
mA
ISB(5)
Standby Current (VCC = 5.0V)
VIN = GND or VCC
0
A
ILI
Input Leakage Current
VIN = GND to VCC
10
A
ILO
Output Leakage Current
VOUT = GND to VCC
10
A
VIL
Input Low Voltage
–1VCC x 0.3
V
VIH
Input High Voltage
VCC x 0.7
VCC + 0.5
V
VOL1
Output Low Voltage (VCC = 3.0V)
IOL = 3 mA
0.4
V
VOL2
Output Low Voltage (VCC = 1.8V)
IOL = 1.5 mA
0.5
V
CAPACITANCE TA = 25°C, f = 1.0 MHz, VCC = 5V
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
CI/O(3)
Input/Output Capacitance (SDA)
VI/O = 0V
8
pF
CIN(3)
Input Capacitance (A0, A1, A2, SCL)
VIN = 0V
6
pF
RELIABILITY CHARACTERISTICS
Symbol
Parameter
Reference Test Method
Min
Typ
Max
Units
NEND(3)
Endurance
MIL-STD-883, Test Method 1033 1,000,000
Cycles/Byte
TDR(3)
Data Retention
MIL-STD-883, Test Method 1008
100
Years
VZAP(3)
ESD Susceptibility
MIL-STD-883, Test Method 3015
2000
Volts
ILTH(3)(4)
Latch-up
JEDEC Standard 17
100
mA
ABSOLUTE MAXIMUM RATINGS*
Temperature Under Bias
–55
°C to +125°C
Storage Temperature ....................... –65
°C to +150°C
Voltage on Any Pin with
Respect to Ground(1) ........... –2.0V to +VCC + 2.0V
VCC with Respect to Ground ............... –2.0V to +7.0V
Package Power Dissipation
Capability (TA = 25
°C) ................................... 1.0W
Lead Soldering Temperature (10 secs) ............ 300
°C
Output Short Circuit Current(2) ........................ 100mA
*COMMENT
Stresses above those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device.
These are stress ratings only, and functional operation of
the device at these or any other conditions outside of those
listed in the operational sections of this specification is not
implied. Exposure to any absolute maximum rating for
extended periods may affect device performance and
reliability.
Note:
(1) The minimum DC input voltage is –0.5V. During transitions, inputs may undershoot to –2.0V for periods of less than 20 ns. Maximum DC
voltage on output pins is VCC +0.5V, which may overshoot to VCC + 2.0V for periods of less than 20ns.
(2) Output shorted for no more than one second. No more than one output shorted at a time.
(3) This parameter is tested initially and after a design or process change that affects the parameter.
(4) Latch-up protection is provided for stresses up to 100 mA on address and data pins from –1V to VCC +1V.
(5) Standby Current (ISB) = 0A (<900nA).
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