參數(shù)資料
型號(hào): CAT3200TDI-TE7
元件分類: DC/DC變換器
英文描述: Low Noise Regulated Charge Pump DC-DC Converter
中文描述: 低噪聲穩(wěn)壓電荷泵DC - DC轉(zhuǎn)換器
文件頁(yè)數(shù): 8/12頁(yè)
文件大?。?/td> 148K
代理商: CAT3200TDI-TE7
CAT3200/3200-5
8
Doc. No. 5002, Rev. E
APPLICATION INFORMATION
Ceramic Capacitors
Ceramic capacitors of different dielectric materials lose
their capacitance with higher temperature and voltage at
different rates. For example, a capacitor made of X5R or
X7R material will retain most of its capacitance from
40
°
C to 85
°
C whereas a Z5U or Y5V style capacitor will
lose considerable capacitance over that range.
Z5U and Y5V capacitors may also have voltage coefficient
causing them to lose 60% or more of their capacitance
when the rated voltage is applied. When comparing
different capacitors it is often useful consider the amount
of achievable capacitance for a given case size rather
than discussing the specified capacitance value. For
example, over rated voltage and temperature conditions,
a 1
μ
F, 10V, Y5V ceramic capacitor in an 0603 case may
not provide any more capacitance than a 0.22
μ
F, 10V,
X7R available in the same 0603 case. For many
CAT3200/CAT3200-5 applications these capacitors can
be considered roughly equivalent.
The capacitor manufacturer
s data sheet should be
consulted to determine what value of capacitor is needed
to ensure the desired capacitance at all temperatures
and voltages. Below is a list of ceramic capacitor
manufacturers and how to contact them:
Capacitor
Manufacturer Web
Phone
Murata
www.murata.com
814.237.1431
AVX/Kemet
www.avxcorp.com
843.448.9411
Vishay
www.vishay.com
Kemet
www.kemet.com
408.986.0424
Taiyo Yuden
www.t-yuden.com
408.573.4150
Thermal Management
For higher input voltages and maximum output current
there can be substantial power dissipation in the
CAT3200/CAT3200-5. If the junction temperature
increases to 160
°
C, the thermal shutdown circuitry will
automatically turn off the output.
A good thermal connection to the PC board is
recommended to reduce the chip temperature.
Connecting the GND pin (Pins 4/5 for CAT3200, Pin 2 for
CAT3200-5) to a ground plane, and maintaining a solid
ground plane under the device reduces the overall
thermal resistance.
The overall junction to ambient thermal resistance (
θ
)
for device power dissipation (P
) consists primarily of
two paths in series. The first path is the junction to the
case (
θ
) which is defined by the package style, and the
second path is case to ambient (
θ
) thermal resistance
which is dependent on board layout. The final operating
junction temperature for any set of conditions can be
estimated by the following thermal equation:
T
=
T
T
P
P
P
JUNC
AMB
D
JC
D
CA
=
+
+
+
(
(
)
)
(
)
Θ
Θ
Θ
AMB
D
JA
The CAT3200 in SOT23 package, when mounted on
printed circuit board with two square inches of copper
allocated for
heat spreading
, will result with an overall
θ
JA
of less than 150
°
C/W.
For a typical application operating from a 3.8V input
supply, the maximum power dissipation is 260mW
(100mA x 3V). This would result if a maximum junction
temperature of :
T
= T
+ P (
AMB
)
= 85 C + 0.26W (150 C/W)
= 85 C + 39 C = 124 C
JUNC
D
JA
θ
The use of multi-layer board construction with power
planes will further enhance the overall thermal
performance. In the event of no dedicated copper area
being used for heat spreading, a multi-layer board will
typically provide the CAT3200 with an overall
θ
of
200
°
C/W. This level of thermal conduction would allow
up to 200mW be safely dissipated within the device.
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