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參數(shù)資料
| 型號： | C850-6 |
| 廠商： | Electronic Theatre Controls, Inc. |
| 英文描述： | Silver Filled, Epoxy Die Attach Adhesive |
| 中文描述： | 銀填充，環(huán)氧芯片粘接膠 |
| 文件頁數(shù)： | 1/2頁 |
| 文件大小： | 74K |
| 代理商： | C850-6 |
AMICON
C 850-6
Silver Filled, Epoxy Die Attach
Adhesive
Key Feature:
One component
Silver filled
Benefit:
Ease of use
Yields excellent electrical and
thermal conductivities
Reduces tailing and stringing
in production equipment
Low viscosity
Product Description:
AMICON C 850-6 is a fast curing, one
component, low viscosity, silver filled epoxy die attach
adhesive. It features high electrical and thermal
conductivity and high strength at wire bond
temperatures. AMICON C 850-6 also features a low
viscosity to avoid tailing, stringing and dry out problems
in high speed die attach equipment.
Applications:
AMICON C 850-6 is designed for bonding
most plastic packaged ICs and other die attach
applications.
Instructions For Use:
Thoroughly read the information concerning
health and safety contained in this bulletin before
using. Observe all precautionary statements that
appear on the product label and/or contained in
individual Material Safety Data Sheets (MSDS).
To ensure the long term performance of the
bonded assembly, complete cleaning of the substrates
should be performed to remove contamination such as
oxide layers, dust, moisture, salt, and oils which can
cause poor adhesion or corrosion in a bonded part. For
information on proper substrate preparation, refer to the
reprint “Good Adhesive Bonding Starts With Surface
Preparation” available from Emerson & Cuming.
Some filler settling is common during shipping
and storage. For this reason, it is recommended that
the contents of the shipping container be thoroughly
mixed prior to use. Power mixing is preferred to ensure
a homogeneous product.
Apply the adhesive to all surfaces to be
bonded and join together. In most applications only
contact pressure is required.
Properties of Material As Supplied:
Property
Chemical Type
Appearance
Density
Brookfield Viscosity
Test Method
Unit
Value
Silver filled epoxy
Silver paste
3.2
75 - 125
75,000 - 125,000
Visual
ASTM-D-792
ASTM-D-2393
5 rpm # TC
g/cm
3
Pa.s
cP
Cure Schedule:
Cure at any one of the recommended cure
schedules. For optimum performance, follow the initial
cure with a post cure of 1-2 hours at the highest
expected use temperature. Alternate cure schedules
may also be possible. Contact your Emerson & Cuming
Technical Representative for further information.
Temperature
°C
125
150
250
Cure Time
Time (minutes)
60
30
1
Internet Address:
www.emersoncuming.com
Technical Data Sheet
“Our service engineers are available to help purchasers obtain best results from our products, and recommendations are based on tests and information believed to be reliable.
However, we have no control over the conditions under which our products are transported to, stored, handled, or used by purchasers and, in any event, all recommendations
and sales are made on condition that we will not be held liable for any damages resulting from their use. No representative of ours has any authority to waive or change this
provision. We also expect purchasers to use our products in accordance with the guiding principles of the Chemical Manufacturers Association’s Responsible Care program.”
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