![](http://datasheet.mmic.net.cn/90000/C70210M0081204_datasheet_3028758/C70210M0081204_2.png)
C702F Smart Card Connectors with landing Card PCB Mount
GSM
0,1
-0
+0,1
39,5
C8
C7
C6
C5
C1
C2
C3
C4
S
C4
C3
C2
C1
C5
C6
C7
C8
S
-0
+0,1
8
x
2,54
(=
20,32)
(30,7)
(61,4)
60,9
61,4
64,5
2,6
3,6
6,4
1,6
±0,2
30,3
18,2
14,3
2,1
36,4
(50,1)
1,5
50,1
43
2,5
2,54
0,7
0,05
1
AFNOR
ISO
7816-2
LESESTELLUNG
ACTIVE POSITION
EIN- / AUSGABESTELLUNG
INACTIVE POSITION
LIEFERUNG ENTHLT 2 SCHRAUBEN
SHIPMENT INCLUDES 2 SCREWS
Description
Termination
Part No.
GSM
Dip solder pin
C702 10M008 120 4
ISO
Dip solder pin
C702 10M008 121 4
AFNOR
Dip solder pin
C702 10M008 122 4
ISO + AFNOR
Dip solder pin
C702 10M008 123 4
C702F Technical Data
Electrical Characteristics
Standard
Value
Contact resistance
IEC 60512-2, Test 2a
Data contacts
≤ 35 m, Switch contacts ≤ 70 m
Insulation resistance
IEC 60512-2, Test 3a
≥ 109
High voltage resistance
IEC 60512-2, Test 4a
500 VAC; 1 min
Climatical Characteristics
Climatic category
IEC 60068-1
25 / 85 / 21
Operating temperature
- 25 °C ... + 85 °C
Storage temperature
- 40 °C ... + 85 °C
Mechanical Characteristics
Card insertion force
IEC 60512-7, Test 13b
≤ 12 N
Card extraction force
IEC 60512-7, Test 13b
≥ 2.5 N
Mechanical lifetime
IEC 60512-5, Test 9a
200,000 mating cycles
(without corrosion stress)
Vibration
IEC 60512-4, Test 6d
f = 10 ... 60 Hz
0.7 mm DA
f = 60 ... 500 Hz
a = 5 g
2 h / axis
Shock, without disconnection
IEC 60512-4, Test 6c
≤ 40 g; 6 ms; halfsine
3 shocks / direction in 3 axis
Shock, without destruction
IEC 60512-4, Test 6c
200 g; 6 ms; halfsine
2 shocks / direction in 3 axis
Contact force
–
20 ... 50 cN
Switch
Card presence switch
normally open
Switch sequence
The card presence switch is activated after the data contacts have mated with the card pads and before the
card reaches its final position. This sequence will take place for the minimum sized pads (and larger) acc. to
ISO 7816
Chattering time
–
≤ 5 ms
40