參數(shù)資料
型號: C67076-A2505-A17
廠商: SIEMENS AG
元件分類: 圓形連接器
英文描述: Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT08; Number of Contacts:5; Connector Shell Size:14; Connecting Termination:Solder; Circular Shell Style:Right Angle Plug
中文描述: IGBT功率模塊(功率模塊3相全橋包括快速滑行二極管)
文件頁數(shù): 1/9頁
文件大小: 137K
代理商: C67076-A2505-A17
Semiconductor Group
1
Feb-10-1997
BSM 25 GD 120 D2
IGBT Power Module
Power module
3-phase full-bridge
Including fast free-wheel diodes
Package with insulated metal base plate
Type
BSM 25 GD 120 D2
V
CE
1200V 35A
I
C
Package
SIXPACK 1
Ordering Code
C67076-A2505-A17
Maximum Ratings
Parameter
Collector-emitter voltage
Symbol
V
CE
V
CGR
Values
1200
Unit
V
Collector-gate voltage
R
GE
= 20 k
Gate-emitter voltage
1200
± 20
V
GE
I
C
DC collector current
T
C
= 25 °C
T
C
= 80 °C
Pulsed collector current, t
p
= 1 ms
T
C
= 25 °C
T
C
= 80 °C
Power dissipation per IGBT
T
C
= 25 °C
Chip temperature
Storage temperature
25
35
A
I
Cpuls
50
70
P
tot
200
W
T
j
T
stg
+ 150
°C
-55 ... + 150
Thermal resistance, chip case
Diode thermal resistance, chip case
Insulation test voltage, t= 1min.
R
thJC
R
thJC
D
V
is
-
-
-
0.6
1
2500
K/W
Vac
Creepage distance
Clearance
DIN humidity category, DIN 40 040
16
11
F
mm
sec
IEC climatic category, DIN IEC 68-1
-
55 / 150 / 56
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