參數(shù)資料
型號: C67047-A4679-A001
廠商: INFINEON TECHNOLOGIES AG
英文描述: Fast switching diode chip in EMCON-Technology
中文描述: 快速開關(guān)二極管芯片快恢復(fù)技術(shù)
文件頁數(shù): 1/4頁
文件大?。?/td> 218K
代理商: C67047-A4679-A001
Preliminary
SIDC30D60E6
Edited by INFINEON Technologies AI PS DD HV3, L 4183M, Edition 1, 8.01.2002
Fast switching diode chip in EMCON-Technology
FEATURES:
600V EMCON technology 70 μm chip
soft , fast switching
low reverse recovery charge
small temperature coefficient
Chip Type
V
R
This chip is used for:
EUPEC power modules and
discrete devices
Applications:
SMPS, resonant applications,
drives
A
C
I
F
Die Size
Package
Ordering Code
C67047-A4679-
A001
SIDC30D60E6
600V
75A
5.5 x 5.5 mm
2
sawn on foil
MECHANICAL PARAMETER:
Raster size
5.5 x 5.5
Area total / active
30.25 / 23.33
Anode pad size
4.78 x 4.78
mm
2
Thickness
70
μm
Wafer size
150
mm
Flat position
180
deg
Max. possible chips per wafer
482 pcs
Passivation frontside
Photoimide
Anode metallisation
3200 nm AlSiCu
Cathode metallisation
1400 nm Ni Ag –system
suitable for epoxy and soft solder die bonding
Die bond
electrically conductive glue or solder
Wire bond
Al,
500μm
Reject Ink Dot Size
0.65mm ; max 1.2mm
store in original container, in dry nitrogen,
< 6 month at an ambient temperature of 23°C
Recommended Storage Environment
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