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參數資料
| 型號： | C470UT200-Sxxxx |
| 廠商： | Cree, Inc. |
| 英文描述： | Cree㈢ UltraThin⑩ LED |
| 中文描述： | Cree公司的LED㈢超?、?/td> |
| 文件頁數： | 1/5頁 |
| 文件大小： | 282K |
| 代理商： | C470UT200-SXXXX |
Subject to change without notice.
www.cree.com
FEATURES
Small Chip – 200 x 200 x 85 μm
UT LED Performance
5.5 mW min. (455–475 nm) Blue
Low Forward Voltage
2.9 V Typical at 5 mA
Single Wire Bond Structure
Class 2 ESD Rating
–
–
APPLICATIONS
Mobile Phone Keypads
Audio Product Display Lighting
Mobile Appliance Keypads
Automotive Applications
Cree
UltraThin LED
Data Sheet
C
xxx
UT200-S
xxxx
Cree’s UltraThin LEDs combine highly efficient InGaN materials with Cree’s proprietary GSiC
substrate to deliver
superior price/performance for blue LEDs. These vertically structured LED chips are small in size and require a low
forward voltage. Cree’s UT series chips are tested for conformity to optical and electrical specifications and the
ability to withstand 1000 V ESD. Applications include keypad backlighting where sub-miniaturization and thinner
form factors are required.
D
C
xxx
UT200-S
xxxx
Chip Diagram
Top View
Bottom View
GSiC LED Chip
200 x 200 μm
SiC Substrate
h = 85 μm
Backside
Metallization
80 x 80 μm
Gold Bond Pad
90 μm Diameter
Die Cross Section
Cathode (-)
Anode (+)
SiC Substrate
Bottom Surface
115 x 115 μm
Mesa (junction)
150 x 150 μm
InGaN
相關PDF資料 |
PDF描述 |
|---|---|
| C470UT230-S0002 | UltraThin⑩ LEDs |
| C470XB500-S3000-A | XBright㈢ Power Chip LED |
| C470XR260-Sxx00-A | XT⑩ Rectangular LEDs |
| C470XR260-Sxx00-x | XT⑩ Rectangular LEDs |
| C470XT290-Sxx00-x | XThin㈢ LEDs |
相關代理商/技術參數 |
參數描述 |
|---|---|
| C470UT2200-0201 | 制造商:CREE 制造商全稱:Cree, Inc 功能描述:Small Chip 200 x 200 x 50 |
| C470UT2200-0202 | 制造商:CREE 制造商全稱:Cree, Inc 功能描述:Small Chip 200 x 200 x 50 |
| C470UT2200-0203 | 制造商:CREE 制造商全稱:Cree, Inc 功能描述:Small Chip 200 x 200 x 50 |
| C470UT2200-0204 | 制造商:CREE 制造商全稱:Cree, Inc 功能描述:Small Chip 200 x 200 x 50 |
| C470UT2200-0205 | 制造商:CREE 制造商全稱:Cree, Inc 功能描述:Small Chip 200 x 200 x 50 |
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