參數(shù)資料
型號(hào): C3310IFH122.88MHZSV033RFHA1
廠商: VECTRON INTERNATIONAL
元件分類: XO, clock
英文描述: CRYSTAL OSCILLATOR, CLOCK, 122.88 MHz, HCMOS OUTPUT
封裝: SURFACE MOUNT PACKAGE-6
文件頁(yè)數(shù): 4/5頁(yè)
文件大小: 150K
代理商: C3310IFH122.88MHZSV033RFHA1
C3310
FCXO
Vectron International www.vectron.com
v.2007-10-04 page 4 of 5
Vectron International
Headquarters
267 Lowell Road
Hudson, New Hampshire 03051
+1-888-328-7661 tel
+1-888-329-8328 fax
Vectron International LLC.
100 W atts Street
Mount Holly Springs, PA 17065
USA
+1-717-486-3411 tel
+1-717-486-5920 fax
Vectron international GmbH & Co. KG
Landstrasse
D-74924 Neckarbischofsheim
Germany
+49-07268-801-0 tel
+49-07268-801-281 fax
Vectron Asia Pacific Sales Office
1F-2F, No 8 W orkshop, No 308 Fenju Road,
W aiGaoQiao Free Trade Zone, Pudong,
Shanghai, P.R. China 200131
+86 21 5048 0777 tel.
+86 21 5048 1881 fax
Standard Shipping Method
*bei W
≤ 24 mm nur untere Lochreihe
by W ≤ 24 mm only lower hole line
Gurtoberseite
Tape upper side
Gurtunterseite
Tape buttom side
Abwickelrichtung
Unwinding direction
Lage im Gurt
Position in tape
Pin 1
A
X
P
B
K
Production tolerance complying DIN IEC 286-3
Enclosure Type
Tape width
W [mm]
Quantity
per meter
Quantity
per reel
Dimension
P
G218B
tbd
850
tbd
Recommended Reflow Profile
Profile Feature
Pb-Free Assembly
/Sn-Pb Assembly
Profile Feature
Pb-Free Assembly
/Sn-Pb Assembly
Average ramp-up rate (TL to Tp)
3°C/second max.
Time 25°C to Peak Temperature
8 minutes max.
Preheat -Temperature Min Tsmin)
-Temperature Min Tsmax)
-Time (min to max) (ts)
150°c
200°c
60-180 seconds
Time maintainted above
- Temperature (TL)
- Time (tL)
217°C
60-150 seconds
Tsmax to TL - Ramp-up Rate
3°C/second max.
Time maintainted above - Temperature (TL)
- Time (tL)
217°C
60-150 seconds
Time within 5°C of actual
Peak Temperature (tp)
20-40 seconds
Peak Temperature (Tp)
max 260°C
Ramp-down Rate
6°C/second max.
Note: All temperatures refer to topside of the package, measured on the package body surface.
SMD oscillators must be on the top side of the PCB during the reflow process.
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