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| 型號(hào)： | C2Q750 |
| 英文描述： | Ultrafast recovery diode |
| 中文描述： | 保險(xiǎn)絲 |
| 文件頁(yè)數(shù)： | 1/2頁(yè) |
| 文件大?。?/td> | 51K |
| 代理商： | C2Q750 |
B e l F u s e In c .
198 Van Vorst Street, J ersey City, NJ 07302 Tel: 201-432-0463 Fax: 201-432-9542 E-Mail: belfuse@belfuse.com
Internet: http://www. belfuse.com
Specifications subject to change without notice
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Protective Overglaze
Element
Tin / Lead Plating
Nickel Barrier
Silver Metalization
Ceramic Substrate
PAD LAYOUT RECOMMENDED
FOR WAVE SOLDER
PAD LAYOUT RECOMMENDED
FOR INFRARED SOLDER
0.03"
0.03"
0.026"
0.05"
0.04"
0.03"
0032
0.018
"
0061
0012
Type C2Q
Surface Mount Very Fast-Acting Chip Fuse
0603 size
Environmental Specification
Soldering Conditions
Infrared Reflow: 260
°
C, 20 sec max.
Wave Solder: 260
°
C, 10 sec max. (MIL-STD-202, Method
210)
Solderability: MIL-STD-202, Method 208
Shock
MIL-STD-202, Method 213, Test Condition I
(100 G’s peak for 6 milliseconds)
Vibration
MIL-STD-202, Method 201 (10-55 Hz, 0.06 inch,
total excursion)
Salt Spray
MIL-STD-202, Method 101, Test Condition B (48 hrs)
Insulation Resistance
MIL-STD-202, Method 302, Test Condition A
(After Opening) 10,000 ohms minimum
Resistance to Solder Heat
MIL-STD-202, Method 210, Test Condition F
(260
°
C, 20 sec)
Thermal Shock
MIL-STD-202, Method 107, Test Condition B
(-65
°
C to +125
°
C)
Operating Temperature
-55
°
C to +125
°
C
C2QD0600
Consult manufacturer for other ratings
Approvals
Physical Specification
Materials
Ceramic Substrate / Printed Element
Marking
On fuse:
None
Label on reel :
“
bel
”, “
C2Q
”, “ Current Rating ”, “ 32V; Interrupting Ratings ” &
“
rSc
”
Packaging
5,000 fuses in 7 inches dia. reel, 8 mm wide tape, per EIA-481
(equivalent IEC-286 part 3)
Mechanical Dimensions
C2Q
(all in inches for reference only)
Electrical Characteristics
(UL/CSA STD. 248-14)
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