參數(shù)資料
型號： C1825C270MZRAC
廠商： KEMET Corporation
英文描述： CERAMIC CHIP / HIGH VOLTAGE
中文描述： 陶瓷芯片/高電壓
文件頁數(shù)： 8/9頁
文件大?。?/td> 1636K
代理商： C1825C270MZRAC
KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
20°
Maximum
component rotation.
Typical
component
center line
Punched Carrier (Paper Tape) Configuration (Ceramic Chips Only):
Table 1: 8 & 12mm Punched Tape
(Metric Dimensions Will Govern)
Variable Dimensions - Millimeters (Inches)
Note:
1. A0, B0 and T determined by the maximum dimensions to the ends of the terminals extending from the
body and/or the body dimensions of the component. The clearance between the ends of the terminals or
body of the component to the sides and depth of the cavity (A0, B0 and T) must be within 0.05mm (.002)
minimum and 0.50mm (.020) maximum. The clearance allowed must also prevent rotation of the component
within the cavity of not more than 20 degrees (see sketches A and B).
2. Tape with components shall pass around radius "R" without damage.
3. KEMET nominal thicknesses are: 0402 = 0.6mm and all others 0.95mm minimum.
8mm
and
12mm
1.5
+0.10, -0.0
(.059
+0.004, -0.0)
1.75 ±0.10
(.069 ±0.004)
4.0 ± 0.10
(.157 ± 0.004)
2.0 ± 0.05
(.079 ± 0.002)
0.10
(.004)
Max.
0.75
(.030)
Min.
0.75
(.030)
Min.
25 (.984)
See Note 2
Table 1
Tape
Size
D0
P0
E
P2
T1
G1
G2
R Min.
8mm
1/2
Pitch
2.0 ± 0.10
(.079 ±.004)
See Require-
ments
Section 3.3 (d)
3.5 ± 0.05
(.138 ± .002)
8.0 ± 0.3
(.315 ± 0.012)
See Note 1
Table 1
1.1mm (.043)
Max. for Paper
Base Tape and
1.6mm (.063)
Max. for Non-
Paper Base
Compositions.
See Note 3.
Tape
Size
P1
W
F
A0B0
T
8mm
4.0 ± 0.10
(0.157 ± .004)
12mm
4.0 ± 0.10
(0.157 ± .004)
12mm
Double
Pitch
8.0 ± 0.10
(0.315 ± .004)
12.0 ± 0.3
(.472 ± .012)
5.5 ± 0.05
(.217 ± .002)
Table 1: 8 & 12mm Punched Tape
(Metric Dimensions Will Govern)
Constant Dimensions - Millimeters (Inches)
Sketch B:
Max. Component
Rotation - Front
Cross Sectional View
Sketch C:
Component Rotation - Top View
A0
B0
P1
P0
P2
D0
F
E
W
Center lines
of cavity
10 pitches cumulative
tolerance on tape
±0.2 (±0.008)
Top
Tape
Cover
T
User Direction of Feed
T1
Max. Cavity Size
See Note 1
Table 1
Bottom
Tape
Cover
G2
R
(Min.)
Sketch A:
Bending Radius
See Note 2
Table 1
CERAMIC CHIP CAPACITORS
Packaging Information
96
相關PDF資料
PDF描述
C2261D287DAB126MHZ TCVCXO, CLOCK, 26 MHz, HCMOS OUTPUT
C2261D287DAA010MHZ TCXO, CLOCK, 10 MHz, HCMOS OUTPUT
C2261D287DAA012MHZ TCXO, CLOCK, 12 MHz, HCMOS OUTPUT
C2261D807DAA112MHZ TCVCXO, CLOCK, 12 MHz, HCMOS OUTPUT
C2304 MMDS / ISM / S-Band Downconverter
相關代理商/技術參數(shù)
參數(shù)描述
C1825C271FBGACTU 功能描述:多層陶瓷電容器MLCC - SMD/SMT 630volts 270pF C0G RoHS:否 制造商:American Technical Ceramics (ATC) 電容:10 pF 容差:1 % 電壓額定值:250 V 溫度系數(shù)/代碼:C0G (NP0) 外殼代碼 - in:0505 外殼代碼 - mm:1414 工作溫度范圍:- 55 C to + 125 C 產(chǎn)品:Low ESR MLCCs 封裝:Reel
C1825C271GBGACTU 功能描述:多層陶瓷電容器MLCC - SMD/SMT 630volts 270pF C0G RoHS:否 制造商:American Technical Ceramics (ATC) 電容:10 pF 容差:1 % 電壓額定值:250 V 溫度系數(shù)/代碼:C0G (NP0) 外殼代碼 - in:0505 外殼代碼 - mm:1414 工作溫度范圍:- 55 C to + 125 C 產(chǎn)品:Low ESR MLCCs 封裝:Reel
C1825C271JBGACTU 功能描述:多層陶瓷電容器MLCC - SMD/SMT 630volts 270pF 5% C0G RoHS:否 制造商:American Technical Ceramics (ATC) 電容:10 pF 容差:1 % 電壓額定值:250 V 溫度系數(shù)/代碼:C0G (NP0) 外殼代碼 - in:0505 外殼代碼 - mm:1414 工作溫度范圍:- 55 C to + 125 C 產(chǎn)品:Low ESR MLCCs 封裝:Reel
C1825C271JBRACTU 功能描述:多層陶瓷電容器MLCC - SMD/SMT 630volts 270pF 5% X7R RoHS:否 制造商:American Technical Ceramics (ATC) 電容:10 pF 容差:1 % 電壓額定值:250 V 溫度系數(shù)/代碼:C0G (NP0) 外殼代碼 - in:0505 外殼代碼 - mm:1414 工作溫度范圍:- 55 C to + 125 C 產(chǎn)品:Low ESR MLCCs 封裝:Reel
C1825C271KBGACTU 功能描述:多層陶瓷電容器MLCC - SMD/SMT 630volts 270pF 10% C0G RoHS:否 制造商:American Technical Ceramics (ATC) 電容:10 pF 容差:1 % 電壓額定值:250 V 溫度系數(shù)/代碼:C0G (NP0) 外殼代碼 - in:0505 外殼代碼 - mm:1414 工作溫度范圍:- 55 C to + 125 C 產(chǎn)品:Low ESR MLCCs 封裝:Reel
發(fā)布緊急采購，3分鐘左右您將得到回復。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*