參數(shù)資料
型號: C1825C270MZGAC
廠商: KEMET Corporation
英文描述: CERAMIC CHIP / HIGH VOLTAGE
中文描述: 陶瓷芯片/高電壓
文件頁數(shù): 4/9頁
文件大?。?/td> 1636K
代理商: C1825C270MZGAC
KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
CERAMIC CHIP / HIGH VOLTAGE
C
0805
C
102
K
C
R
A
C
Style
C - Ceramic
Chip Size
0805; 1206; 1210; 1808;
1812; 1825; 2220; 2225
Specification
C - Standard
Capacitance Code, pF
First two digits represent significant figures.
Third digit specifies number of zeros. 100 pF = 101.
(Use “9” for 1.0 through 9.9 pF)
(Use “8” for 0.1 through .99 pF)
Capacitance Tolerance
C = ±0.25pF*
J = ±5%
D = ±0.5pF*
K = ±10%
F = ±1%*
M = ±20%
G = ±2%*
* Contact KEMET Sales for availability.
Voltage
C = 500V
G = 2000V
D = 1000V
Z = 2500V
F = 1500V
H = 3000V
Temperature Characteristic
Designated by Capacitance
Change over Temperature Range
G – (C0G) (±30ppm/C) (-55°C +125°C)
R – X7R (±15%) (-55°C +125°C)
End Metallization
C = Standard
Failure Rate Level
A = Not Applicable
Capacitor Ordering Information
Property
Specification
Capacitance
C0G: 1 pF to 0.010 F
X7R: 10 pf to 0.22 F
25°C, 1.0 ± 0.2 Vrms, 1 kHz (1 MHz for
≤ 1000 pF (C0G only)
Cap Tolerance
C0G: C*, D*, F*, G*, J, K, M
* Contact KEMET Sales for availability.
X7R: J, K, M
DF
C0G: 0.1% Max
X7R: 2.5% Max
Voltage Ratings
500 V, 1000 V, 1500 V, 2000 V, 2500 V, 3000 V
Operating Temperature Range
From -55C to +125C
25C IR @ 500V
100 G
or 1000 M-F, whichever is less
125C IR @ 500V
10 G
or 100 M-F, whichever is less
-55C TCC
+125C TCC
X7R: + 15%
C0G: + 30 ppm / C
Dielectric Strength
150% of Rated Voltage for Rated Voltage <1000 V
120% of Rated Voltage for Rated Voltage >=1000V
Ripple Current
Consult KEMET Sales Representative
Electrical Parameters
Marking
These chips are supplied unmarked. If required, they can be supplied LASER-marked at an extra cost.
Packaging
KEMET High Voltage Surface Mount MLCC are available packaged in tape and reel configuration, or bulk
Soldering Process
The 0805 and 1206 case sizes are suitable for either reflow or wave soldering processes. Sizes 1210 and
larger should be limited to reflow soldering only. All sizes incorporate the standard KEMET barrier layer of
pure nickel with an overplating of pure tin (Sn) for excellent solderability and resistance to solder leaching of
Recommended Solder Pad Dimensions
the termination.
bag as outlined on page 8
3. Please consult factory for waffle packaging options.
Details on the marking format is located on page 9
7.
mm
in.
mm
in.
mm
in.
mm
in.
0805
3.30
0.130
0.70
0.028
1.60
0.063
1.30
0.051
1206
4.50
0.177
1.50
0.059
2.00
0.079
1.50
0.059
1210
4.50
0.177
1.50
0.059
2.90
0.114
1.50
0.059
1808
5.90
0.232
2.30
0.091
2.40
0.094
1.80
0.071
1812
5.90
0.232
2.30
0.091
3.70
0.146
1.80
0.071
1825
5.90
0.232
2.30
0.091
6.90
0.272
1.80
0.071
2220
7.00
0.276
3.30
0.130
5.50
0.217
1.85
0.073
2225
7.00
0.276
3.30
0.130
6.80
0.268
1.85
0.073
L (Pad Length)
Chip Size
T (Total Length)
S (Separation
W (Pad Width)
pF
From -55C to +125C
CAPACITOR ORDERING INFORMATION
ELECTRICAL PARAMETERS
MARKING
PACKAGING
SOLDERING PROCESS
RECOMMENDED SOLDER PAD DIMENSIONS
Style
Chip Size
Specification
Capacitance Code, pF
Capacitance Tolerance
Voltage
Temperature Characteristic
Failure Rate Level
End Metallization
84
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