參數(shù)資料
型號： C1825C270MHRAC
廠商： KEMET Corporation
英文描述： CERAMIC CHIP / HIGH VOLTAGE
中文描述： 陶瓷芯片/高電壓
文件頁數(shù)： 5/9頁
文件大?。?/td> 1636K
代理商： C1825C270MHRAC
KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
KEMET offers Multilayer Ceramic Chip Capacitors
packaged in 8mm and 12mm plastic tape on 7" and
13" reels in accordance with EIA standard 481-1:
Taping of surface mount components for automatic
handling. This packaging system is compatible with all
tape fed automatic pick and place systems. See page 78
for details on reeling quantities for commercial chips
and page 87 for MIL-PRF-55681 chips.
CERAMIC CHIP CAPACITORS
Packaging Information
Tape & Reel Packaging
8mm ±.30
(.315 ±.012")
or
12mm ±.30
(.472 ±.012")
178mm (7.00")
or
330mm (13.00")
Anti-Static Reel
Embossed Carrier*
0402 and 0603 case sizes
available on punched paper only.
Embossment
Anti-Static Cover Tape
(.10mm (.004") Max Thickness)
Chip Orientation
in Pocket
(except 1825 Commercial, and 1825 & 2225 Military)
* Punched paper carrier used for 0402 and 0603 case size.
g
handling. This packaging system is compatible with all
tape fed automatic pick and place systems. See page 81
for details on reeling quantities for commercial chips
and page 90 for MIL-PRF-55681 chips.
KEMET
X
C
G
Z
Y
Grid
placement
courtyard
Z
2.14
2.78
3.30
4.50
5.90
7.00
G
0.28
0.68
0.70
1.50
2.30
3.30
X
0.74
1.08
1.60
2.00
2.90
3.70
6.90
5.50
6.80
Y(ref)
0.93
1.05
1.30
1.50
1.80
1.85
C(ref)
1.21
1.73
2.00
3.00
4.10
5.15
Z
3.18
3.70
4.90
G
0.68
0.70
1.50
X
0.80
1.10
1.40
2.00
Y(ref)
1.25
1.50
1.70
Smin
1.93
2.20
3.20
Wave Solder
Reflow Solder
Calculation Formula
Z = Lmin + 2Jt + Tt
G = Smax - 2Jh -Th
X = Wmin + 2Js + Ts
Tt, Th, Ts = Combined tolerances
0402
0603
0805
1206
1210
1812
1825
2220
2225
Dimension
Not Recommended
C
X
Grid
Placement
Courtyard
G
Y
Z
SURFACE MOUNT LAND DIMENSIONS - CERAMIC CHIP CAPACITORS - MM
93
Packaging
相關PDF資料
PDF描述
C1825C270MZGAC CERAMIC CHIP / HIGH VOLTAGE
C1825C270MZRAC CERAMIC CHIP / HIGH VOLTAGE
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相關代理商/技術參數(shù)
參數(shù)描述
C1825C270MZGAC 制造商:KEMET 制造商全稱:Kemet Corporation 功能描述:CERAMIC CHIP / HIGH VOLTAGE
C1825C270MZRAC 制造商:KEMET 制造商全稱:Kemet Corporation 功能描述:CERAMIC CHIP / HIGH VOLTAGE
C1825C271FBGACTU 功能描述:多層陶瓷電容器MLCC - SMD/SMT 630volts 270pF C0G RoHS:否 制造商:American Technical Ceramics (ATC) 電容:10 pF 容差:1 % 電壓額定值:250 V 溫度系數(shù)/代碼:C0G (NP0) 外殼代碼 - in:0505 外殼代碼 - mm:1414 工作溫度范圍:- 55 C to + 125 C 產(chǎn)品:Low ESR MLCCs 封裝:Reel
C1825C271GBGACTU 功能描述:多層陶瓷電容器MLCC - SMD/SMT 630volts 270pF C0G RoHS:否 制造商:American Technical Ceramics (ATC) 電容:10 pF 容差:1 % 電壓額定值:250 V 溫度系數(shù)/代碼:C0G (NP0) 外殼代碼 - in:0505 外殼代碼 - mm:1414 工作溫度范圍:- 55 C to + 125 C 產(chǎn)品:Low ESR MLCCs 封裝:Reel
C1825C271JBGACTU 功能描述:多層陶瓷電容器MLCC - SMD/SMT 630volts 270pF 5% C0G RoHS:否 制造商:American Technical Ceramics (ATC) 電容:10 pF 容差:1 % 電壓額定值:250 V 溫度系數(shù)/代碼:C0G (NP0) 外殼代碼 - in:0505 外殼代碼 - mm:1414 工作溫度范圍:- 55 C to + 125 C 產(chǎn)品:Low ESR MLCCs 封裝:Reel
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