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      參數(shù)資料
      型號: C1825C220MZGAC
      廠商: KEMET Corporation
      英文描述: CERAMIC CHIP / HIGH VOLTAGE
      中文描述: 陶瓷芯片/高電壓
      文件頁數(shù): 8/9頁
      文件大?。?/td> 1636K
      代理商: C1825C220MZGAC
      KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
      20
      °
      20
      °
      Maximum
      Typical
      Punched Carrier (Paper Tape) Configuration (Ceramic Chips Only):
      Table 1: 8 & 12mm Punched Tape
      (
      Metric Dimensions Will Govern)
      Variable Dimensions - Millimeters (Inches)
      Note:
      1. A0, B0 and T determined by the maximum dimensions to the ends of the terminals extending from the
      body and/or the body dimensions of the component. The clearance between the ends of the terminals or
      body of the component to the sides and depth of the cavity (A0, B0 and T) must be within 0.05mm (.002)
      minimum and 0.50mm (.020) maximum. The clearance allowed must also prevent rotation of the component
      within the cavity of not more than 20 degrees (see sketches A and B).
      2. Tape with components shall pass around radius "R" without damage.
      3. KEMET nominal thicknesses are: 0402 = 0.6mm and all others 0.95mm minimum.
      8mm
      and
      12mm
      1.5
      +0.10, -0.0
      (.059
      +0.004, -0.0)
      1.75
      ±
      0.10
      (.069
      ±
      0.004)
      4.0
      ±
      0.10
      (.157
      ±
      0.004)
      2.0
      ±
      0.05
      (.079
      ±
      0.002)
      0.10
      (.004)
      Max.
      0.75
      (.030)
      Min.
      0.75
      (.030)
      Min.
      25 (.984)
      See Note 2
      Table 1
      Tape
      Size
      D
      0
      P
      0
      E
      P
      2
      T
      1
      G
      1
      G
      2
      R Min.
      8mm
      1/2
      Pitch
      2.0
      ±
      0.10
      (.079
      ±
      .004)
      See Require-
      ments
      Section 3.3 (d)
      4.0
      ±
      0.10
      (0.157
      ±
      .004)
      3.5
      ±
      0.05
      (.138
      ±
      .002)
      8.0
      ±
      0.3
      (.315
      ±
      0.012)
      See Note 1
      Table 1
      1.1mm (.043)
      Max. for Paper
      Base Tape and
      1.6mm (.063)
      Max. for Non-
      Paper Base
      Compositions.
      See Note 3.
      Tape
      Size
      P
      1
      W
      F
      A
      0
      B
      0
      T
      8mm
      12mm
      4.0
      ±
      0.10
      (0.157
      ±
      .004)
      8.0
      ±
      0.10
      (0.315
      ±
      .004)
      12mm
      Double
      Pitch
      12.0
      ±
      0.3
      (.472
      ±
      .012)
      5.5
      ±
      0.05
      (.217
      ±
      .002)
      Table 1: 8 & 12mm Punched Tape
      (
      Metric Dimensions Will Govern)
      Constant Dimensions - Millimeters (Inches)
      Sketch B:
      Max. Component
      Rotation - Front
      Cross Sectional View
      Sketch C:
      Component Rotation - Top View
      A
      0
      B
      0
      P
      1
      P
      0
      P
      2
      D
      0
      F
      E
      W
      Center lines
      of cavity
      10 pitches cumulative
      tolerance on tape
      ±
      0.2 (
      ±
      0.008)
      Top
      Tape
      Cover
      T
      User Direction of Feed
      T
      1
      Max. Cavity Size
      See Note 1
      Table 1
      Bottom
      Tape
      Cover
      G
      2
      R
      Sketch A:
      Bending Radius
      See Note 2
      Table 1
      CERAMIC CHIP CAPACITORS
      Packaging Information
      96
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