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    參數(shù)資料
    型號(hào): C1812C100MCRAC
    廠商: KEMET Corporation
    英文描述: CERAMIC CHIP / HIGH VOLTAGE
    中文描述: 陶瓷芯片/高電壓
    文件頁(yè)數(shù): 5/9頁(yè)
    文件大?。?/td> 1636K
    代理商: C1812C100MCRAC
    KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
    KEMET offers Multilayer Ceramic Chip Capacitors
    packaged in 8mm and 12mm plastic tape on 7" and
    13" reels in accordance with EIA standard 481-1:
    Taping of surface mount components for automatic
    handling. This packaging system is compatible with all
    tape
    fed
    automatic
    pick
    and
    place
    systems. See page
    7
    8
    for details on reeling quantities for commercial chips
    and page
    87
    for MIL-PRF-55681 chips.
    g
    handling. This packaging system is compatible with all
    tape
    fed
    automatic
    pick
    and
    place
    systems. See page 81
    for details on reeling quantities for commercial chips
    and page 90 for MIL-PRF-55681 chips.
    CERAMIC CHIP CAPACITORS
    Packaging Information
    Tape & Reel Packaging
    8mm
    ±
    .30
    (.315
    ±
    .012")
    or
    12mm
    ±
    .30
    (.472
    ±
    .012")
    178mm (7.00")
    or
    330mm (13.00")
    Anti-Static Reel
    Embossed Carrier*
    0402 and 0603 case sizes
    available on punched paper only.
    Embossment
    Anti-Static Cover Tape
    (.10mm (.004") Max Thickness)
    Chip Orientation
    in Pocket
    (except 1825 Commercial, and 1825 & 2225 Military)
    * Punched paper carrier used for 0402 and 0603 case size.
    KEMET
    X
    C
    G
    Z
    Y
    Grid
    placement
    courtyard
    "
    Z
    2.14
    2.78
    3.30
    4.50
    4.50
    5.90
    5.90
    7.00
    7.00
    G
    0.28
    0.68
    0.70
    1.50
    1.50
    2.30
    2.30
    3.30
    3.30
    X
    0.74
    1.08
    1.60
    2.00
    2.90
    3.70
    6.90
    5.50
    6.80
    Y(ref)
    0.93
    1.05
    1.30
    1.50
    1.50
    1.80
    1.80
    1.85
    1.85
    C(ref)
    1.21
    1.73
    2.00
    3.00
    3.00
    4.10
    4.10
    5.15
    5.15
    Z
    3.18
    3.70
    4.90
    4.90
    G
    0.68
    0.70
    1.50
    1.50
    X
    0.80
    1.10
    1.40
    2.00
    Y(ref)
    1.25
    1.50
    1.70
    1.70
    Smin
    1.93
    2.20
    3.20
    3.20
    Wave Solder
    Reflow Solder
    Calculation Formula
    Z = Lmin + 2Jt + Tt
    G = Smax - 2Jh -Th
    X = Wmin + 2Js + Ts
    Tt, Th, Ts = Combined tolerances
    0402
    0603
    0805
    1206
    1210
    1812
    1825
    2220
    2225
    Dimension
    Not Recommended
    Not Recommended
    #
    $
    SURFACE MOUNT LAND DIMENSIONS - CERAMIC CHIP CAPACITORS - MM
    93
    P
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    相關(guān)代理商/技術(shù)參數(shù)
    參數(shù)描述
    C1812C100MDGAC 制造商:KEMET 制造商全稱:Kemet Corporation 功能描述:CERAMIC CHIP / HIGH VOLTAGE
    C1812C100MDRAC 制造商:KEMET 制造商全稱:Kemet Corporation 功能描述:CERAMIC CHIP / HIGH VOLTAGE
    C1812C100MFGAC 制造商:KEMET 制造商全稱:Kemet Corporation 功能描述:CERAMIC CHIP / HIGH VOLTAGE
    C1812C100MFRAC 制造商:KEMET 制造商全稱:Kemet Corporation 功能描述:CERAMIC CHIP / HIGH VOLTAGE
    C1812C100MGGAC 制造商:KEMET 制造商全稱:Kemet Corporation 功能描述:CERAMIC CHIP / HIGH VOLTAGE