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    參數(shù)資料
    型號: C1210X181K3RAC
    廠商: KEMET Corporation
    英文描述: Surface Mount Ceramic Chip Capacitors / FT-CAP / Flexible Terminations
    中文描述: 表面貼裝陶瓷電容/紅外第/柔性終止
    文件頁數(shù): 1/4頁
    文件大?。?/td> 121K
    代理商: C1210X181K3RAC
    F3281 5/07
    Product Bulletin
    Dimensions – Millimeters (Inches)
    EIA Size
    Code
    Metric Size
    Code
    L
    Length
    W
    Width
    B
    Bandwidth
    S
    Separation
    0603
    1608
    1.6 (.063) ± 0.15 (.006)
    0.8 (.032) ± 0.15 (.006)
    0.35 (.014) ± 0.15 (.006)
    0.70 (.028)
    0805
    2012
    2.0 (.079) ± 0.20 (.008)
    1.25 (.049) ± 0.20 (.008)
    0.05 (.02) ± 0.25 (.010)
    0.75 (.030)
    1206
    3216
    3.2 (.126) ± 0.20 (.008)
    1.6 (.063) ± 0.20 (.008)
    0.50 (.02) ± .25 (.010)
    N/A
    1210
    3225
    3.2 (.126) ± 0.20 (.008)
    2.5 (.098) ± 0.20 (.008)
    0.50 (.02) ± .25 (.010)
    N/A
    Outline Drawing
    Surface Mount Ceramic Chip Capacitors
    /
    FT-CAP
    /
    Flexible Terminations
    See Capacitance Value Table next page for thickness dimension.
    C
    0603
    X
    224
    K
    3
    R
    A
    C
    Style
    C - Ceramic
    Size Code
    See dimension table
    Specification
    X - Flexible Termination
    Capacitance Code, pF
    First two digits represent significant figures.
    Third digit specifies number of zeros. 100 pF = 101.
    (Use “9” for 1.0 through 9.9 pF)
    Capacitance Tolerance
    K = ±10%; M = ±20%; J = ±5%
    Voltage
    9 = 6.3V, 8 = 10V, 4 = 16V, 3 = 25V,
    5 = 50V, 1 = 100V, 2 = 200V
    Temperature Characteristic
    Designated by Capacitance
    Change over Temperature Range
    R – X7R (±15%) (-55°C +125°C)
    End Metallization
    C = Standard (Tin-plate)
    Failure Rate Level
    A = Not Applicable
    Ordering Information
    The FT-CAP is a surface mount multi-layer ceramic capacitor that incorporates a unique and flexible termi-
    nation system. Integrated with KEMET's standard termination materials, a conductive epoxy is utilized
    between the conductive metallization and nickel barrier finish in order to establish pliability while maintain-
    ing terminal strength, solderability and electrical performance. This technology directs board flex stress away
    from the ceramic body and into the termination area. As a result, this termination system mitigates the risk
    of low-IR or short-circuit failures associated with board flex. The FT-CAP complements our current "Open
    Mode" and "Flexible Electrode (FE-CAP)" products by providing our customers with a complete portfolio of
    flex solutions.
    Tin Plate
    Nickel Plate
    Silver Epoxy
    Conductive Metallization
    Electrodes
    T
    W
    S
    L
    B
    相關(guān)PDF資料
    PDF描述
    C1210X181K4RAC Surface Mount Ceramic Chip Capacitors / FT-CAP / Flexible Terminations
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