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參數(shù)資料
| 型號(hào)： | C1093 |
| 廠商： | NEC Corp. |
| 英文描述： | ADJUSTABLE PRECISION SHUNT REGULATORS |
| 中文描述： | 可調(diào)節(jié)精密并聯(lián)穩(wěn)壓器 |
| 文件頁(yè)數(shù)： | 4/16頁(yè) |
| 文件大小： | 109K |
| 代理商： | C1093 |
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PC1093
12
RECOMMENDED SOLDERING CONDITIONS
When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering
processes are used, or if the soldering is performed under different conditions, please make sure to consult with our
sales offices.
For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”
(C10535E).
Through-hole device
PC1093J: 3-pin plastic SIP (TO-92)
Process
Conditions
Wave soldering
Solder temperature: 260
°C or below,
(only to leads)
Flow time: 10 seconds or less.
Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure
that the package body does not get jet soldered.
Surface mount devices
PC1093G: 8-pin plastic SOP (225 mil)
Process
Conditions
Symbol
Infrared ray reflow
Peak temperature: 230
°C or below (Package surface temperature),
IR30-00-1
Reflow time: 30 seconds or less (at 210
°C or higher),
Maximum number of reflow processes: 1 time.
VPS
Peak temperature: 215
°C or below (Package surface temperature),
VP15-00-1
Reflow time: 40 seconds or less (at 200
°C or higher),
Maximum number of reflow processes: 1 time.
Wave soldering
Solder temperature: 260
°C or below, Flow time: 10 seconds or less,
WS60-00-1
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120
°C or below (Package surface temperature).
Caution Apply only one kind of soldering condition to a device, or the device will be damaged by heat stress.
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