參數(shù)資料
型號(hào)： C0805C103F5GAC
廠商： KEMET Corporation
英文描述： CERAMIC CHIP/STANDARD
中文描述： 陶瓷芯片/標(biāo)準(zhǔn)
文件頁數(shù)： 1/2頁
文件大?。?/td> 39K
代理商： C0805C103F5GAC
KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
38
KEMET
C 0805 C 103 K
5 R
A C*
CERAMIC
SIZE CODE
SPECIFICATION
C - Standard
CAPACITANCE CODE
Expressed in Picofarads (pF)
First two digits represent significant figures.
Third digit specifies number of zeros. (Use 9
for 1.0 thru 9.9pF. Use 8 for 0.5 through 0.99pF)
(Example: 2.2pF = 229 or 0.50 pF = 508)
CAPACITANCE TOLERANCE
B – ±0.10pF
J – ±5%
C – ±0.25pF
K – ±10%
D – ±0.5pF
M – ±20%
F – ±1%
P – (GMV)
G– ±2%
Z – +80%, -20%
L #
W #
WIDTH
T (EIA) #
B
S
MOUNTING
TECHNIQUE
Solder Reflow
LENGTH
1.0 (.04) ± .05(.002)
THICKNESS MAX.
0.55 (.022)
BANDWIDTH
0.20 (0.008)-0.40 (0.016)
MIN. SEPARATION
0.3 (.012)
0.5 (.02) ± .05 (.002)
1.6 (.063) ± 0.15 (.006)
0.8 (.032) ± 0.15 (.006)
0.9 (.035)
0.35 (.014) ±0.15 (.006)
0.7 (.028)
2.0 (.079) ± 0.2 (.008)
1.25 (.049) ± 0.2 (.008)
1.3 (.051)
0.5 (.02) ±.25 (.010)
0.75 (.030)
Soldor
3.2 (.126) ± 0.2 (.008)
1.6 (.063) ± 0.2 (.008)
1.5 (.059)
0.5 (.02) ±.25 (.010)
N/A
Solder Reflow
3.2 (.126) ± 0.2 (.008)
2.5 (.098) ± 0.2 (.008)
1.7 (.067)
0.5 (.02) ±.25 (.010)
N/A
4.5 (.177) ± 0.3 (.012)
3.2 (.126) ± 0.3 (.012)
1.7 (.067)
0.6 (.024) ±.35 (.014)
N/A
4.5 (.177) ± 0.3 (.012)
6.4 (.252) ± 0.4 (.016)
1.7 (.067)
0.6 (.024) ±.35 (.014)
N/A
5.6 (.220) ± 0.4 (.016)
5.0 (.197) ± 0.4 (.016)
1.8 (.071)
0.6 (.024) ±.35 (.014)
N/A
5.6 (.220) ± 0.4 (.016)
6.3 (.248) ± 0.4 (.016)
2.0 (.079)
0.6 (.024) ±.35 (.014)
N/A
DIMENSIONS—MILLIMETERS AND (INCHES)
CAPACITOR ORDERING INFORMATION
C0G (NP0), X7R, Z5U and Y5V Dielectrics
10, 16, 25, 50, 100 and 200 Volts
Standard End Metalization: Tin-plate over nickel
barrier
Available Capacitance Tolerances: ±0.10 pF; ±0.25
pF; ±0.5 pF; ±1%; ±2%; ±5%; ±10%; ±20%; and
+80%-20%
Tape and reel packaging per EIA481-1. (See page
51 for specific tape and reel information.) Bulk
Cassette packaging (0402, 0603, 0805 only) per
IEC60286-6 and EIAJ 7201.
FEATURES
CAPACITOR OUTLINE DRAWINGS
END METALLIZATION
C-Standard
(Tin-plated nickel barrier)
FAILURE RATE LEVEL
A- Not Applicable
TEMPERATURE CHARACTERISTIC
Designated by Capacitance
Change Over Temperature Range
G – C0G (NP0) (±30 PPM/°C)
R – X7R (±15%)
U – Z5U (+22%, -56%)
V – Y5V (+22%, -82%)
VOLTAGE
1 - 100V
2 - 200V
5 - 50V
(14 digits - no spaces)
3 - 25V
4 - 16V
8 - 10V
W
L
T
B
S
TIN PLATE
NICKEL PLATE
CONDUCTIVE
METALLIZATION
ELECTRODES
* Part Number Example: C0805C103K5RAC
* Note: Indicates EIA Preferred Case Sizes
# Note: Different tolerances apply for 0402, 0603, and 0805 packaged in bulk cassette.
Solder
Reflow
CERAMIC CHIP/STANDARD
METRIC
SIZE CODE
(Ref only)
1005
1608
2012
3216
3225
4532
4564
5650
5664
EIA
SIZE CODE
0402*
0603*
0805*
1206*
1210*
1812
1825*
2220
2225
(Standard Chips - For
Military see page 45)
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參數(shù)描述
C0805C103F5GAC7800 功能描述:多層陶瓷電容器MLCC - SMD/SMT .010UF 50.0V RoHS:否 制造商:American Technical Ceramics (ATC) 電容:10 pF 容差:1 % 電壓額定值:250 V 溫度系數(shù)/代碼:C0G (NP0) 外殼代碼 - in:0505 外殼代碼 - mm:1414 工作溫度范圍:- 55 C to + 125 C 產(chǎn)品:Low ESR MLCCs 封裝:Reel
C0805C103F5GACTU 功能描述:多層陶瓷電容器MLCC - SMD/SMT 50volts 0.01uF 1% C0G RoHS:否 制造商:American Technical Ceramics (ATC) 電容:10 pF 容差:1 % 電壓額定值:250 V 溫度系數(shù)/代碼:C0G (NP0) 外殼代碼 - in:0505 外殼代碼 - mm:1414 工作溫度范圍:- 55 C to + 125 C 產(chǎn)品:Low ESR MLCCs 封裝:Reel
C0805C103F5GAL 功能描述:多層陶瓷電容器MLCC - SMD/SMT .010UF 50.0V RoHS:否 制造商:American Technical Ceramics (ATC) 電容:10 pF 容差:1 % 電壓額定值:250 V 溫度系數(shù)/代碼:C0G (NP0) 外殼代碼 - in:0505 外殼代碼 - mm:1414 工作溫度范圍:- 55 C to + 125 C 產(chǎn)品:Low ESR MLCCs 封裝:Reel
C0805C103F5GAL7800 功能描述:CAP CER 10000PF 50V C0G/NP0 0805 制造商:kemet 系列:L 包裝:帶卷（TR） 零件狀態(tài):在售 電容:10000pF 容差:±1% 電壓 - 額定:50V 溫度系數(shù):C0G，NP0 工作溫度:-55°C ~ 125°C 特性:低 ESL 型 等級(jí):- 應(yīng)用:通用 故障率:- 安裝類型:表面貼裝，MLCC 封裝/外殼:0805（2012 公制） 大小/尺寸:0.079" 長 x 0.049" 寬（2.00mm x 1.25mm） 高度 - 安裝（最大值）:- 厚度（最大值）:0.035"（0.88mm） 引線間距:- 引線形式:- 標(biāo)準(zhǔn)包裝:4,000
C0805C103F5GALTU 制造商:KEMET Corporation 功能描述:Cap Ceramic 0.01uF 50V C0G 1% SMD 0805 125
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