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    參數(shù)資料
    型號(hào): C0402C758C3RAC
    廠商: KEMET Corporation
    英文描述: CERAMIC CHIP CAPACITORS
    中文描述: 陶瓷芯片電容器
    文件頁數(shù): 1/9頁
    文件大小: 1045K
    代理商: C0402C758C3RAC
    KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
    CERAMIC CHIP CAPACITORS
    C
    C 0805 C 103 K
    5 R
    A C*
    CERAMIC
    SIZE CODE
    SPECIFICATION
    C - Standard
    CAPACITANCE CODE
    Expressed in Picofarads (pF)
    First two digits represent significant figures.
    Third digit specifies number of zeros. (Use 9
    for 1.0 through 9.9pF. Use 8 for 0.5 through 0.99pF)
    (Example: 2.2pF = 229 or 0.50 pF = 508)
    CAPACITANCE TOLERANCE
    B – ±0.10pF
    J – ±5%
    C – ±0.25pF
    K – ±10%
    D – ±0.5pF
    M – ±20%
    F – ±1%
    P – (GMV) – special order only
    G– ±2%
    Z – +80%, -20%
    DIMENSIONS—MILLIMETERS AND (INCHES)
    CAPACITOR ORDERING INFORMATION
    C0G (NP0), X7R, X5R, Z5U and Y5V Dielectrics
    10, 16, 25, 50, 100 and 200 Volts
    Standard End Metalization: Tin-plate over nickel
    barrier
    Available Capacitance Tolerances: ±0.10 pF; ±0.25
    pF; ±0.5 pF; ±1%; ±2%; ±5%; ±10%; ±20%; and
    +80%-20%
    Tape and reel packaging per EIA481-1. (See page
    92 for specific tape and reel information.) Bulk
    Cassette packaging (0402, 0603, 0805 only) per
    IEC60286-6 and EIAJ 7201.
    RoHS Compliant
    FEATURES
    CAPACITOR OUTLINE DRAWINGS
    END METALLIZATION
    C-Standard (Tin-plated nickel barrier)
    FAILURE RATE LEVEL
    A- Not Applicable
    TEMPERATURE CHARACTERISTIC
    Designated by Capacitance
    Change Over Temperature Range
    G – C0G (NP0) (±30 PPM/°C)
    R – X7R (±15%) (-55°C + 125°C)
    P– X5R (±15%) (-55°C + 85°C)
    U – Z5U (+22%, -56%) (+10°C + 85°C)
    V – Y5V (+22%, -82%) (-30°C + 85°C)
    VOLTAGE
    1 - 100V
    2 - 200V
    5 - 50V
    (14 digits - no spaces)
    7 - 4V
    3 - 25V
    4 - 16V
    8 - 10V
    9 - 6.3V
    W
    L
    T
    B
    S
    TIN PLATE
    NICKEL PLATE
    CONDUCTIVE
    METALLIZATION
    ELECTRODES
    * Part Number Example: C0805C103K5RAC
    or
    Solder
    Reflow
    METRIC
    SIZE CODE
    0603
    1005
    1608
    2012
    3216
    3225
    4532
    4564
    5650
    5664
    1608
    EIA
    SIZE CODE
    0201*
    0402*
    0603
    0805*
    1206*
    1210*
    1812
    1825*
    2220
    2225
    (Standard Chips - For
    Military see page
    87
    )
    CODE
    SIZE CODE
    L - LENGTH
    W - WIDTH
    T
    THICKNESS
    B - BANDWIDTH
    S
    SEPARATION
    minimum
    N/A
    0.3 (.012)
    0.7 (.028)
    0.75 (.030)
    N/A
    N/A
    N/A
    N/A
    N/A
    N/A
    MOUNTING
    TECHNIQUE
    0.6 (.024) ± .03 (.001)
    1.0 (.04) ± .05 (.002)
    1.6 (.063) ± .15 (.006)
    2.0 (.079) ± .20 (.008)
    3.2 (.126) ± .20 (.008)
    3.2 (.126) ± .20 (.008)
    4.5 (.177) ± .30 (.012)
    4.5 (.177) ± .30 (.012)
    5.6 (.220) ± .40 (.016)
    5.6 (.220) ± .40 (.016)
    0.3 ± (.012) ± .03 (.001)
    0.5 (.02) ± .05 (.002)
    0.8 (.032) ± .15 (.006)
    1.25 (.049) ± .20 (.008)
    1.6 (.063) ± .20 (.008)
    2.5 (.098) ± .20 (.008)
    3.2 (.126) ± .30 (.012)
    6.4 (.252) ± .40 (.016)
    5.0 (.197) ± .40 (.016)
    6.3 (.248) ± .40 (.016)
    0.15 (.006) ± .05 (.002)
    0.20 (.008) -.40 (.016)
    0.35 (.014) ± .15 (.006)
    0.50 (.02) ± .25 (.010)
    0.50 (.02) ± .25 (.010)
    0.50 (.02) ± .25 (.010)
    0.60 (.024) ± .35 (.014)
    0.60 (.024) ± .35 (.014)
    0.60 (.024) ± .35 (.014)
    0.60 (.024) ± .35 (.014)
    * Note: Indicates EIA Preferred Case Sizes (Tightened tolerances apply for 0402, 0603, and 0805 packaged in bulk bassette, see page 96.)
    + For extended value 1210 case size - solder reflow only.
    Solder Wave +
    or
    Solder Reflow
    Solder Reflow
    See page 7
    8
    for thickness
    dimensions.
    Solder Reflow
    72
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