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參數(shù)資料
| 型號(hào)： | C-161-2500-FDFB-SLC4 |
| 元件分類： | 光收發(fā) |
| 英文描述： | FIBER OPTIC TRANSCEIVER, 1605-1618nm, 2488Mbps(Tx), 2488Mbps(Rx), BOARD/PANEL MOUNT, LC CONNECTOR |
| 文件頁(yè)數(shù)： | 9/10頁(yè) |
| 文件大小： | 814K |
| 代理商： | C-161-2500-FDFB-SLC4 |
8
2.5 Gbps Single Mode SFF LC Transceiver
C-1XX-2500(C)-FDFB-SLCX
20550 Nordhoff St. Chatsworth, CA 91311 tel: 818.773.9044 fax: 818.576.9486
9F, No 81, Shui Lee Rd. Hsinchu, Taiwan, R.O.C. tel: 886.3.5169222 fax: 886.3.5169213
LUMNDS851-Jul2005
rev. A.0
LUMINENTOIC.COM
EMI and ESC Consideration
Printed Circuit Board Layout Consideration
A ber-optic receiver employs a very high gain, wide bandwidth transimpedance amplier. This amplier detects and amplies signals
that are only tens of nA in amplitude when the receiver is operating near it’s limit. Any unwanted signal current that couples into the
receiver circuitry causes a decrease in the receiver’s sensitivity and can also degrade the performance of the receiver’s signal detect (SD) circuit.
To minimize the coupling of unwanted noise into the receiver, careful attention must be given to the printed circuit board.
At a minimum, a double-sided printed circuit board(PCB) with a large component side ground plane beneath the transceiver must be
used. In applications that include many other high speed devices, a multi-layer PCB is highly recommended. This permits the placement of
power and ground on separate layers, wich allows them to be isolated from the signal lines. Multilayer construction also permits the routing
of signal traces away from high level, high speed sinal lines. To minimize the possibility of coupling noise into the receiver section, high level,
high speed signals such as transmitter inputs and clock lines should be routed as far away as possible from the receiver pins.
Noise that couples into the receiver through the power supply pins can also degrade performance. It is recommended that a pi lter be
used in both transmitter and receiver power supplies.
LuminentOIC transceivers offer a metalized plastic case and a special chassis grounding clip. As shown in the drawing, this clip connects
the module case to chassis ground then installs ush through the panel cutout. This way, the grounding clip brushes the edge of the cutout in
order to make a proper contact. The use of a grounding clip also provides increased electrostatic protection and helps reduce radiated emission
from the module or the host circuit board through the chassis faceplate. The attaching posts are at case potential and may be connected to
chassis ground. They should not be connected to circuit ground.
Plastic optical subassemblies are used to further reduce the possibility of radiated emission by eliminating the metal from the
transmitter and receiver diode housings, which extend into connector space. By providing a non-metal receptacle for the optical cable ferrule,
the gigabit speed RF electrical signal is isolated from the connector area thus preventing radiated energy leakage from these surfaces to the
outside of the panel.
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