參數(shù)資料
型號(hào): BYV26C
廠(chǎng)商: NXP SEMICONDUCTORS
元件分類(lèi): 參考電壓二極管
英文描述: Fast soft-recovery controlled avalanche rectifiers
中文描述: 0.65 A, 600 V, SILICON, SIGNAL DIODE
封裝: HERMETIC SEALED, GLASS PACKAGE-2
文件頁(yè)數(shù): 2/12頁(yè)
文件大小: 74K
代理商: BYV26C
1996 May 30
2
Philips Semiconductors
Product specification
Fast soft-recovery
controlled avalanche rectifiers
BYV26 series
FEATURES
Glass passivated
High maximum operating
temperature
Low leakage current
Excellent stability
Guaranteed avalanche energy
absorption capability
Available in ammo-pack.
DESCRIPTION
Rugged glass SOD57 package, using
a high temperature alloyed
construction.
This package is hermetically sealed
and fatigue free as coefficients of
expansion of all used parts are
matched.
Fig.1 Simplified outline (SOD57) and symbol.
2/3 page (Datasheet)
MAM047
a
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
RRM
repetitive peak reverse voltage
BYV26A
BYV26B
BYV26C
BYV26D
BYV26E
BYV26F
BYV26G
continuous reverse voltage
BYV26A
BYV26B
BYV26C
BYV26D
BYV26E
BYV26F
BYV26G
average forward current
BYV26A to E
BYV26F and G
200
400
600
800
1000
1200
1400
V
V
V
V
V
V
V
V
R
200
400
600
800
1000
1200
1400
V
V
V
V
V
V
V
I
F(AV)
T
tp
= 85
°
C; lead length = 10 mm;
see Figs 2 and 3;
averaged over any 20 ms period;
see also Figs 10 and 11
T
amb
= 60
°
C; PCB mounting (see
Fig.19); see Figs 4 and 5;
averaged over any 20 ms period;
see also Figs 10 and 11
T
tp
= 85
°
C; see Figs 6 and 7
1.00
1.05
A
A
I
F(AV)
average forward current
BYV26A to E
BYV26F and G
0.65
0.68
A
A
I
FRM
repetitive peak forward current
BYV26A to E
BYV26F and G
10.0
9.6
A
A
相關(guān)PDF資料
PDF描述
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