參數資料
型號: BYV26
廠商: NXP Semiconductors N.V.
英文描述: Fast soft-recovery controlled avalanche rectifiers
中文描述: 快速軟恢復控制雪崩整流器
文件頁數: 4/12頁
文件大小: 74K
代理商: BYV26
1996 May 30
4
Philips Semiconductors
Product specification
Fast soft-recovery
controlled avalanche rectifiers
BYV26 series
THERMAL CHARACTERISTICS
Note
1.
Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer
40
μ
m, see Fig.19.
For more information please refer to the “General Part of associated Handbook”
maximum slope of reverse recovery
current
BYV26A to C
BYV26D and E
BYV26F and G
when switched from
I
F
= 1 A to V
R
30 V and
dI
F
/dt =
1 A/
μ
s;
see Fig.21
7
6
5
A/
μ
s
A/
μ
s
A/
μ
s
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
R
th j-tp
R
th j-a
thermal resistance from junction to tie-point
thermal resistance from junction to ambient
lead length = 10 mm
note 1
46
K/W
K/W
100
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
dI
R
dt
--------
相關PDF資料
PDF描述
BYV26A Fast soft-recovery controlled avalanche rectifiers
BYV26B Fast soft-recovery controlled avalanche rectifiers
BYV26C Fast soft-recovery controlled avalanche rectifiers
BYV26D ECONOLINE: RQS & RQD - 1kVDC Isolation- Internal SMD Construction- UL94V-0 Package Material- Toroidal Magnetics- Efficiency to 80%
BYV26E ECONOLINE: RQS & RQD - 1kVDC Isolation- Internal SMD Construction- UL94V-0 Package Material- Toroidal Magnetics- Efficiency to 80%
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