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參數(shù)資料
| 型號： | BYV1100 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 參考電壓二極管 |
| 英文描述： | Hook-Up Wire; Conductor Size AWG:22; No. Strands x Strand Size:19 x 34; Jacket Color:Brown; Approval Bodies:UL; Approval Categories:UL AWM Style 1180; Passes VW-1 Flame Test; Cable/Wire MIL SPEC:MIL-W-16878/5 Type EE RoHS Compliant: Yes |
| 中文描述： | 1 A, 100 V, SILICON, SIGNAL DIODE |
| 封裝： | HERMETIC SEALED, GLASS PACKAGE-2 |
| 文件頁數(shù)： | 4/12頁 |
| 文件大小： | 64K |
| 代理商： | BYV1100 |
1998 Dec 03
4
Philips Semiconductors
Product specification
Fast soft-recovery rectifier
BYV1100
GRAPHICAL DATA
Switched mode application.
a = 1.42;
δ
= 0.5; V
R
= V
RRMmax
.
Fig.2
Maximum permissible average forward
current as a function of tie-point temperature
(including losses due to reverse leakage).
handbook, halfpage
(A)
0
200
0
0.4
MGR565
0.8
1.2
1.6
40
80
120
160
Ttp (
°
C)
Switched mode application.
a = 1.42;
δ
= 0.5; V
R
= V
RRMmax
.
Device mounted as shown in Fig.12.
Fig.3
Maximum permissible average forward
current as a function of ambient temperature
(including losses due to reverse leakage).
handbook, halfpage
(A)
0
200
0
0.4
MGR564
0.8
1.2
1.6
40
80
120
160
Tamb (
°
C)
Fig.4
Maximum steady state power dissipation
(forward plus leakage current losses,
excluding switching losses) as a function of
average forward current.
a = I
F(RMS)
/I
F(AV)
;
δ
= 0.5; V
R
= V
RRMmax
.
handbook, halfpage
P
(W)
0
2.0
IF(AV) (A)
0
0.4
0.8
1.2
1.6
0.4
0.8
1.2
1.6
MBK899
a = 3
2.5
2
1.57
1.42
Dotted line: T
j
= 175
°
C.
Solid line: T
j
= 25
°
C.
Fig.5
Maximum forward voltage as a function of
forward current.
handbook, halfpage
(A)
0
1
2
4
0
16
MGR563
3
12
8
4
VF (V)
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