參數(shù)資料
型號(hào): BYD57K
廠商: NXP SEMICONDUCTORS
元件分類: 參考電壓二極管
英文描述: Fast soft-recovery controlled avalanche rectifiers(快速軟恢復(fù)控制的雪崩整流器)
中文描述: 0.4 A, 800 V, SILICON, SIGNAL DIODE
封裝: HERMETIC SEALED, GLASS, SOD-87, 2 PIN
文件頁(yè)數(shù): 2/12頁(yè)
文件大?。?/td> 77K
代理商: BYD57K
1999 Nov 11
2
Philips Semiconductors
Product specification
Ultra-fast soft-recovery
controlled avalanche rectifiers
BYD57 series
FEATURES
Glass passivated
High maximum operating
temperature
Low leakage current
Excellent stability
Guaranteed avalanche energy
absorption capability
Shipped in 8 mm embossed tape
Smallest surface mount rectifier
outline.
DESCRIPTION
Cavity free cylindrical glass SOD87
package through Implotec
(1)
technology. The SOD87 is
hermetically sealed and fatigue free
as coefficients of expansion of all
used parts are matched.
(1) Implotec is a trademark of Philips.
handbook, 4 columns
MAM061
k
a
Fig.1 Simplified outline (SOD87) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
RRM
repetitive peak reverse voltage
BYD57D
BYD57G
BYD57J
BYD57K
BYD57M
BYD57U
BYD57V
continuous reverse voltage
BYD57D
BYD57G
BYD57J
BYD57K
BYD57M
BYD57U
BYD57V
average forward current
BYD57D to M
BYD57U and V
average forward current
BYD57D to M
BYD57U and V
200
400
600
800
1000
1200
1400
V
V
V
V
V
V
V
V
R
200
400
600
800
1000
1200
1400
V
V
V
V
V
V
V
I
F(AV)
T
tp
= 85
°
C; see Figs 2 and 3;
averaged over any 20 ms period;
see also Figs 10 and 11
1.0
1.2
A
A
I
F(AV)
T
amb
= 60
°
C; PCB mounting (see
Fig.17); see Figs 4 and 5;
averaged over any 20 ms period;
see also Figs 10 and 11
T
tp
= 85
°
C; see Figs 6 and 7
0.4
0.4
A
A
I
FRM
repetitive peak forward current
BYD57D to M
BYD57U and V
8.5
11
A
A
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