參數(shù)資料
型號: BYD47-16
廠商: NXP SEMICONDUCTORS
元件分類: 參考電壓二極管
英文描述: Fast soft-recovery controlled avalanche rectifiers
中文描述: 0.34 A, 1600 V, SILICON, SIGNAL DIODE
封裝: HERMETIC SEALED, GLASS PACKAGE-2
文件頁數(shù): 2/12頁
文件大?。?/td> 66K
代理商: BYD47-16
1999 Nov 11
2
Philips Semiconductors
Product specification
Fast soft-recovery
controlled avalanche rectifiers
BYD47 series
FEATURES
Glass passivated
High maximum operating
temperature
Low leakage current
Excellent stability
Shipped in 8 mm embossed tape
Smallest surface mount
rectifier outline.
DESCRIPTION
Cavity free cylindrical glass SOD87
package through Implotec
(1)
technology. This package is
hermetically sealed and fatigue free
as coefficients of expansion of all
used parts are matched.
(1) Implotec is a trademark of Philips.
handbook, 4 columns
MAM061
k
a
Fig.1 Simplified outline (SOD87) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
RSM
non-repetitive peak reverse voltage
BYD47-16
BYD47-18
BYD47-20
repetitive peak reverse voltage
BYD47-16
BYD47-18
BYD47-20
average forward current
1700
1900
2100
V
V
V
V
RRM
1600
1800
2000
0.80
V
V
V
A
I
F(AV)
T
tp
= 105
°
C; see Fig.2;
averaged over any 20 ms period;
see also Fig.6
T
amb
= 25
°
C; PCB mounting (see
Fig.11); see Fig.3;
averaged over any 20 ms period;
see also Fig.6
T
tp
= 85
°
C; see Fig.4
T
amb
= 65
°
C; see Fig.5
t = 10 ms half sine wave; T
j
= T
j max
prior to surge; V
R
= V
RRMmax
I
F(AV)
average forward current
0.34
A
I
FRM
repetitive peak forward current
8.0
2.8
10
A
A
A
I
FSM
non-repetitive peak forward current
T
stg
T
j
storage temperature
junction temperature
65
65
+175
+175
°
C
°
C
see Fig.7
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