參數(shù)資料
型號(hào): BYD37G
廠商: NXP SEMICONDUCTORS
元件分類: 參考電壓二極管
英文描述: Fast soft-recovery controlled avalanche rectifiers
中文描述: 0.6 A, 400 V, SILICON, SIGNAL DIODE
封裝: HERMETIC SEALED, GLASS PACKAGE-2
文件頁數(shù): 2/12頁
文件大小: 65K
代理商: BYD37G
1999 Nov 16
2
Philips Semiconductors
Product specification
Fast soft-recovery
controlled avalanche rectifiers
BYD37 series
FEATURES
Glass passivated
High maximum operating
temperature
Low leakage current
Excellent stability
Guaranteed avalanche energy
absorption capability
Smallest surface mount rectifier
outline
Shipped in 8 mm embossed tape.
DESCRIPTION
Cavity free cylindrical glass package
through Implotec
(1)
technology.
This package is hermetically sealed
and fatigue free as coefficients of
expansion of all used parts are
matched.
(1) Implotec is a trademark of Philips.
handbook, 4 columns
MAM061
k
a
Fig.1 Simplified outline (SOD87) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
RRM
repetitive peak reverse voltage
BYD37D
BYD37G
BYD37J
BYD37K
BYD37M
continuous reverse voltage
BYD37D
BYD37G
BYD37J
BYD37K
BYD37M
average forward current
200
400
600
800
1000
V
V
V
V
V
V
R
200
400
600
800
1000
1.5
V
V
V
V
V
A
I
F(AV)
T
tp
= 105
°
C; see Fig.2;
averaged over any 20 ms period;
see also Fig.6
T
amb
= 60
°
C; PCB mounting (see
Fig.11); see Fig.3;
averaged over any 20 ms period;
see also Fig.6
T
tp
= 105
°
C; see Fig.4
T
amb
= 60
°
C; see Fig.5
t = 10 ms half sine wave; T
j
= T
j max
prior to surge; V
R
= V
RRMmax
I
F(AV)
average forward current
0.6
A
I
FRM
repetitive peak forward current
13
5.5
20
A
A
A
I
FSM
non-repetitive peak forward current
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