參數(shù)資料
型號(hào): BYD33U
廠商: NXP SEMICONDUCTORS
元件分類: 參考電壓二極管
英文描述: Fast soft-recovery controlled avalanche rectifiers
中文描述: SILICON, SIGNAL DIODE
封裝: HERMETICALLY SEALED, GLASS PACKAGE-2
文件頁(yè)數(shù): 4/12頁(yè)
文件大?。?/td> 65K
代理商: BYD33U
1996 Sep 18
4
Philips Semiconductors
Product specification
Fast soft-recovery
controlled avalanche rectifiers
BYD33 series
THERMAL CHARACTERISTICS
Note
1.
Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer
40
μ
m, see Fig.19.
For more information please refer to the “General Part of associated Handbook”
maximum slope of reverse recovery
current
BYD33D to J
BYD33K to V
when switched from
I
F
= 1 A to V
R
30 V
and dI
F
/dt =
1 A/
μ
s;
see Fig.20
6
5
A/
μ
s
A/
μ
s
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
R
th j-tp
R
th j-a
thermal resistance from junction to tie-point
thermal resistance from junction to ambient
lead length = 10 mm
note 1
60
K/W
K/W
120
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
dI
R
dt
--------
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