參數(shù)資料
型號: BYD32
廠商: NXP Semiconductors N.V.
英文描述: Fast soft-recovery controlled avalanche rectifiers
中文描述: 快速軟恢復(fù)控制雪崩整流器
文件頁數(shù): 3/8頁
文件大?。?/td> 51K
代理商: BYD32
1998 Dec 03
3
Philips Semiconductors
Preliminary specification
Fast soft-recovery controlled
avalanche rectifiers
BYD32 series
THERMAL CHARACTERISTICS
Note
1.
Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of copper layer
40
μ
m,
pitch 5 mm; see Fig.6.
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
R
th j-a
thermal resistance from junction to ambient
note 1
150
K/W
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BYD33 Fast soft-recovery controlled avalanche rectifiers
BYD33D Fast soft-recovery controlled avalanche rectifiers
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相關(guān)代理商/技術(shù)參數(shù)
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BYD32D 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Fast soft-recovery controlled avalanche rectifiers
BYD32G 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Fast soft-recovery controlled avalanche rectifiers
BYD32J 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Fast soft-recovery controlled avalanche rectifiers
BYD32SERIES 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Fast soft-recovery controlled avalanche rectifiers
BYD33 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Fast soft-recovery controlled avalanche rectifiers