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參數(shù)資料
| 型號(hào)： | BX805555060P |
| 廠商： | INTEL CORP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 64-BIT, MICROPROCESSOR, BGA771 |
| 封裝： | LGA-771 |
| 文件頁(yè)數(shù)： | 32/104頁(yè) |
| 文件大?。?/td> | 3690K |
| 代理商： | BX805555060P |
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Dual-Core Intel Xeon Processor 5000 Series Datasheet
33
Mechanical Specifications
3
Mechanical Specifications
The Dual-Core Intel Xeon Processor 5000 series are packaged in a Flip Chip Land Grid
Array (FC-LGA6) package that interfaces to the baseboard via a LGA771 socket. The
package consists of a processor core mounted on a pinless substrate with 771 lands. An
integrated heat spreader (IHS) is attached to the package substrate and core and
serves as the interface for processor component thermal solutions such as a heatsink.
Figure 3-1 shows a sketch of the processor package components and how they are
assembled together. .
The package components shown in Figure 3-1 include the following:
1. Integrated Heat Spreader (IHS)
2. Thermal Interface Material (TIM)
3. Processor Core (die)
4. Package Substrate
5. Landside capacitors
6. Package Lands
Note:
This drawing is not to scale and is for reference only.
3.1
Package Mechanical Drawings
The package mechanical drawings are shown in Figure 3-2 through Figure 3-4. The
drawings include dimensions necessary to design a thermal solution for the processor
including:
1. Package reference and tolerance dimensions (total height, length, width, an so
forth)
2. IHS parallelism and tilt
3. Land dimensions
4. Top-side and back-side component keepout dimensions
5. Reference datums
Note:
All drawing dimensions are in mm [in.].
Figure 3-1. Processor Package Assembly Sketch
IHS
Substrate
LGA771 Socket
System Board
Capacitors
Core (die)
TIM
Package Lands
IHS
Substrate
LGA771 Socket
System Board
Capacitors
Core (die)
TIM
Package Lands
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| BX805555060P S L96A | 制造商:Intel 功能描述:MPU Xeon 制造商:Intel 功能描述:MPU Xeon? Processor 5060 65nm 3.2GHz 771-Pin FCLGA6 |
| BX805565120P S L9RY | 制造商:Intel 功能描述:MPU Xeon 制造商:Intel 功能描述:MPU Xeon? Processor 5120 RISC 64-Bit 65nm 1.86GHz 771-Pin LGA Box |
| BX805565130A S LAGC | 制造商:Intel 功能描述:5100 MEMORY CONTROLLER HUB CHIPSET |
| BX805565140P S LABN | 制造商:Intel 功能描述:MPU Xeon 制造商:Intel 功能描述:MPU Xeon? Processor 5140 RISC 64-Bit 65nm 2.33GHz 1.35V/1.5V 771-Pin FCLGA6 Box |
| BX805565148A S LABH | 制造商:Intel 功能描述:MPU Xeon |
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