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參數(shù)資料

型號：	BX80546PG3400E
廠商：	INTEL CORP
元件分類：	微控制器/微處理器
英文描述：	32-BIT, 3400 MHz, MICROPROCESSOR, CPGA478
封裝：	1.27 MM PITCH, FLIP CHIP, MICRO PGA-478
文件頁數(shù)：	23/80頁
文件大小：	1845K
代理商：	BX80546PG3400E

Datasheet

Contents

Introduction ..................................................................................................................9

1.1

Terminology......................................................................................................... 10

1.1.1

Processor Packaging Terminology......................................................... 10

1.2

References .......................................................................................................... 11

Electrical Specifications........................................................................................13

2.1

Power and Ground Pins ...................................................................................... 13

2.2

Decoupling Guidelines ........................................................................................ 13

2.2.1

VCC Decoupling ......................................................................................13

2.2.2

FSB GTL+ Decoupling ........................................................................... 13

2.2.3

FSB Clock (BCLK[1:0]) and Processor Clocking.................................... 14

2.3

Voltage Identification ........................................................................................... 14

2.3.1

Phase Lock Loop (PLL) Power and Filter............................................... 16

2.4

Reserved, Unused, and TESTHI Pins................................................................. 17

2.5

FSB Signal Groups.............................................................................................. 18

2.6

Asynchronous GTL+ Signals............................................................................... 19

2.7

Test Access Port (TAP) Connection.................................................................... 19

2.8

FSB Frequency Select Signals (BSEL[1:0]) ........................................................ 20

2.9

Absolute Maximum and Minimum Ratings .......................................................... 21

2.10

Processor DC Specifications............................................................................... 21

2.11

VCC Overshoot Specification...............................................................................29

2.11.1 Die Voltage Validation ............................................................................ 30

Package Mechanical Specifications.................................................................31

3.1

Package Mechanical Specifications .................................................................... 31

3.1.1

Package Mechanical Drawing ................................................................ 32

3.1.2

Processor Component Keep-out Zones ................................................. 35

3.1.3

Package Loading Specifications ............................................................ 35

3.1.4

Package Handling Guidelines ................................................................ 35

3.1.5

Package Insertion Specifications ........................................................... 36

3.1.6

Processor Mass Specification ................................................................ 36

3.1.7

Processor Materials................................................................................ 36

3.1.8

Processor Markings................................................................................ 36

3.1.9

Processor Pinout Coordinates................................................................ 37

Pin List and Signal Description..........................................................................39

4.1

Processor Pin Assignments ................................................................................ 39

4.2

Alphabetical Signals Reference .......................................................................... 54

Thermal Specifications and Design Considerations .................................63

5.1

Processor Thermal Specifications....................................................................... 63

5.1.1

Thermal Specifications ........................................................................... 63

5.1.2

Thermal Metrology ................................................................................. 66

5.2

Processor Thermal Features............................................................................... 67

5.2.1

Thermal Monitor ..................................................................................... 67

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