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參數(shù)資料
| 型號： | BX80532PC2600D |
| 廠商： | INTEL CORP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 2600 MHz, MICROPROCESSOR, XMA |
| 封裝： | BOXED PROCESSOR |
| 文件頁數(shù)： | 79/88頁 |
| 文件大?。?/td> | 1502K |
| 代理商： | BX80532PC2600D |
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80
Intel Pentium 4 Processor on 0.13 Micron Process Datasheet
Boxed Processor Specifications
The target load applied by the clips to the processor heat spreader for Intel’s reference design is
75 ± 15 lbf (maximum load is constrained by the package load capability). It is normal to observe a
bow or bend in the board due to this compressive load on the processor package and the socket.
The level of bow or bend depends on the motherboard material properties and component layout.
Any additional board stiffening devices such as plates are not necessary and should not be used
along with the reference mechanical components and boxed processor. Using such devices increase
the compressive load on the processor package and socket, likely beyond the maximum load that is
specified for those components. Refer to the Intel Pentium 4 Processor with 512-KB L2 Cache
on 0.13 Micron Process Thermal Design Guidelines for details on the Intel reference design.
7.3
Electrical Requirements
7.3.1
Fan Heatsink Power Supply
The boxed processor's fan heatsink requires a +12 V power supply. A fan power cable will be
shipped with the boxed processor to draw power from a power header on the motherboard. The
power cable connector and pinout are shown in Figure 7-4. Motherboards must provide a matched
power header to support the boxed processor. Table 7-1 contains specifications for the input and
output signals at the fan heatsink connector. The fan heatsink outputs a SENSE signal, which is an
open-collector output that pulses at a rate of two pulses per fan revolution. A motherboard pull-up
resistor provides VOH to match the system board-mounted fan speed monitor requirements, if
applicable. Use of the SENSE signal is optional. If the SENSE signal is not used, pin 3 of the
connector should be tied to GND.
Note: The motherboard must supply a constant +12 V to the processor’s power header to ensure proper
operation of the variable speed fan for the boxed processor.
The power header on the baseboard must be positioned to allow the fan heatsink power cable to
reach it. The power header identification and location should be documented in the platform
documentation, or on the system board itself. Figure 7-5 shows the location of the fan power
connector relative to the processor socket. The motherboard power header should be positioned
within 4.33 inches from the center of the processor socket.
Figure 7-4. Boxed Processor Fan Heatsink Power Cable Connector Description
Pin
Signal
Straight square pin, 3-pin terminal housing with
polarizing ribs and friction locking ramp.
0.100" pin pitch, 0.025" square pin width.
Waldom*/Molex* P/N22-01-3037 or equivalent.
Match with straight pin, friction lock header on motherboard
Waldom/Molex P/N22-23-2031, AMP* P/N640456-3,
or equivalent.
1
2
3
GND
+12V
SENSE
12 3
相關(guān)PDF資料 |
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| BU-61583D0-100L | 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CQIP70 |
| BU-61583D0-100Q | 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CQIP70 |
| BU-61583D0-100Z | 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CQIP70 |
| BU-61583D0-101S | 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CQIP70 |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| BX80532PE2266D | 制造商:Intel 功能描述:MPU PENTIUM 4 PROCESSOR NETBURST 64-BIT 0.13UM 2.26GHZ 478- - Boxed Product (Development Kits) |
| BX80532PE2400D | 制造商:Intel 功能描述:MPU PENTIUM 4 NETBURST 64-BIT 0.13UM 2.4GHZ 478-PIN FCPGA2 - Boxed Product (Development Kits) |
| BX80532PE2533D | 制造商:Intel 功能描述:MPU PENTIUM 4 NETBURST 64-BIT 0.13UM 2.53GHZ 478-PIN FCPGA2 - Boxed Product (Development Kits) |
| BX80532PE2667D | 制造商:Intel 功能描述:MPU PENTIUM 4 NETBURST 64-BIT 0.13UM 2.66GHZ 478-PIN FCPGA2 - Boxed Product (Development Kits) |
| BX80532PE2800D | 制造商:Intel 功能描述:MPU PENTIUM 4 NETBURST 64-BIT 0.13UM 2.8GHZ 478-PIN FCPGA2 - Boxed Product (Development Kits) |
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