- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄369560 > BUF11705AIPWPR 22 - V Supply, 10 + 1 Channel Gamma Correction Buffer PDF資料下載
參數(shù)資料
| 型號： | BUF11705AIPWPR |
| 英文描述： | 22 - V Supply, 10 + 1 Channel Gamma Correction Buffer |
| 中文描述： | 22 - V供電，10 1通道伽瑪校正緩沖器 |
| 文件頁數(shù)： | 13/17頁 |
| 文件大?。?/td> | 317K |
| 代理商： | BUF11705AIPWPR |
"#$$%&'
SBOS349 DECEMBER 2005
www.ti.com
13
GENERAL PowerPAD DESIGN
CONSIDERATIONS
The BUF11705 is available in the thermally-enhanced
PowerPAD package. This package is constructed using
a downset leadframe upon which the die is mounted, as
shown in Figure 27(a) and (b). This arrangement
results in the lead frame being exposed as a thermal
pad on the underside of the package; see Figure 27(c).
Due to this thermal pad having direct thermal contact
with the die, excellent thermal performance is achieved
by providing a good thermal path away from the thermal
pad.
The PowerPAD package allows for both assembly and
thermal management in one manufacturing operation.
During the surface-mount solder operation (when the
leads are being soldered), the thermal pad must be
soldered to a copper area underneath the package.
Through the use of thermal paths within this copper
area, heat can be conducted away from the package
into either a ground plane or other heat-dissipating
device.
Soldering the PowerPAD to the PCB is
always required, even with applications that have
low power dissipation.
This provides the necessary
thermal and mechanical connection between the lead
frame die pad and the PCB.
The PowerPAD must be connected to the most
negative supply voltage of the device.
1. Prepare the PCB with a top-side etch pattern. There
should be etching for the leads as well as etch for the
thermal pad.
2. Place recommended holes in the area of the thermal
pad. Ideal thermal land size and thermal via patterns
can be seen in technical brief, SLMA002
PowerPAD
Thermally-Enhanced Package
, available for down-
load at www.ti.com. These holes should be 13 mils
in diameter. Keep them small, so that solder wicking
through the holes is not a problem during reflow.
3. Additional vias may be placed anywhere along the
thermal plane outside of the thermal pad area. This
helps dissipate the heat generated by the
BUF11705 IC. These additional vias may be larger
than the 13-mil diameter vias directly under the
thermal pad. They can be larger because they are
not in the thermal pad area to be soldered; so that,
wicking is not a problem.
4. Connect all holes to the internal ground plane.
5. When connecting these holes to the ground plane,
do not
use the typical web or spoke via connection
methodology. Web connections have a high thermal
resistance connection that is useful for slowing the
heat transfer during soldering operations. Web
connections make the soldering of vias easier. In
this application, however, low thermal resistance is
desired for the most efficient heat transfer.
Therefore, the holes under the BUF11705
PowerPAD package should make their connection
to the internal ground plane with a complete
connection around the entire circumference of the
plated-through hole.
6. The top-side solder mask should leave the terminals
of the package and the thermal pad area with its ten
holes exposed. The bottom-side solder mask
should cover the holes of the thermal pad area. This
prevents solder from being pulled away from the
thermal pad area during the reflow process.
7. Apply solder paste to the exposed thermal pad area
and all of the IC terminals.
8. With these preparatory steps in place, the
BUF11705 IC is simply placed in position and run
through the solder reflow operation as any standard
surface-mount component. This preparation results
in a properly installed part.
DIE
Side View (a)
End View (b)
Bottom View (c)
DIE
T
P
The thermal pad is electrically isolated from all terminals in the package.
Figure 27. Views of Thermally-Enhanced DGN Package
相關PDF資料 |
PDF描述 |
|---|---|
| BUF12800 | REFERENCE VOLTAGE GENERATOR for LCD GAMMA CORRECTION |
| BUF12800AIPWP | REFERENCE VOLTAGE GENERATOR for LCD GAMMA CORRECTION |
| BUF12800AIPWPR | REFERENCE VOLTAGE GENERATOR for LCD GAMMA CORRECTION |
| BUF16820 | 14-Channel GAMMA VOLTAGE GENERATOR with Programmable VCOM Outputs and OTP Memory |
| BUF16820AIDAPR | 14-Channel GAMMA VOLTAGE GENERATOR with Programmable VCOM Outputs and OTP Memory |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| BUF11705AIPWPRG4 | 功能描述:LCD Gamma緩沖器 22-V Supply 10+1 Ch Correction RoHS:否 制造商:Maxim Integrated 輸入補償電壓: 轉換速度: 電源電壓-最大:20 V 電源電壓-最小:9 V 電源電流: 最大功率耗散: 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:TQFN-38 封裝:Tube |
| BUF12800 | 制造商:BB 制造商全稱:BB 功能描述:REFERENCE VOLTAGE GENERATOR for LCD GAMMA CORRECTION |
| BUF12800AIPWP | 功能描述:LCD Gamma緩沖器 Ref Vltg Generator for Correction RoHS:否 制造商:Maxim Integrated 輸入補償電壓: 轉換速度: 電源電壓-最大:20 V 電源電壓-最小:9 V 電源電流: 最大功率耗散: 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:TQFN-38 封裝:Tube |
| BUF12800AIPWPG4 | 功能描述:LCD Gamma緩沖器 Ref Vltg Generator for Correction RoHS:否 制造商:Maxim Integrated 輸入補償電壓: 轉換速度: 電源電壓-最大:20 V 電源電壓-最小:9 V 電源電流: 最大功率耗散: 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:TQFN-38 封裝:Tube |
| BUF12800AIPWPR | 功能描述:LCD Gamma緩沖器 Ref Vltg Generator for Correction RoHS:否 制造商:Maxim Integrated 輸入補償電壓: 轉換速度: 電源電壓-最大:20 V 電源電壓-最小:9 V 電源電流: 最大功率耗散: 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:TQFN-38 封裝:Tube |
發(fā)布緊急采購，3分鐘左右您將得到回復。