參數(shù)資料
型號: BUF11702PWP
文件頁數(shù): 22/28頁
文件大?。?/td> 501K
代理商: BUF11702PWP
BUF11702
10+1-CHANNEL LCD GAMMA CORRECTION BUFFER
SLOS359B
MARCH 2001
REVISED OCTOBER 2001
22
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
APPLICATION INFORMATION
general PowerPAD design considerations
The BUF11702 is available in the thermally enhanced PowerPAD family of packages. These packages are
constructed using a downset leadframe upon which the die is mounted [see Figure 51(a) and Figure 51(b)]. This
arrangement results in the lead frame being exposed as a thermal pad on the underside of the package [see
Figure 51(c)]. Because this thermal pad has direct thermal contact with the die, excellent thermal performance
can be achieved by providing a good thermal path away from the thermal pad.
The PowerPAD package allows for both assembly and thermal management in one manufacturing operation.
During the surface-mount solder operation (when the leads are being soldered), the thermal pad can also be
soldered to a copper area underneath the package. Through the use of thermal paths within this copper area,
heat can be conducted away from the package into either a ground plane or other heat-dissipating device.
DIE
Side View (a)
End View (b)
Bottom View (c)
DIE
Thermal
Pad
NOTE A: The thermal pad is electrically isolated from all terminals in the package.
Figure 51. Views of Thermally Enhanced DGN Package
Although there are many ways to properly heatsink the PowerPAD package, the following steps illustrate the
recommended approach.
Y mils x Z mils with 18 vias
(Via diameter = 13 mils)
Figure 52. PowerPAD PCB Etch and Via Pattern
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相關代理商/技術參數(shù)
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BUF11702PWPG4 功能描述:LCD Gamma緩沖器 10+1 Ch Hi Current Buffer RoHS:否 制造商:Maxim Integrated 輸入補償電壓: 轉換速度: 電源電壓-最大:20 V 電源電壓-最小:9 V 電源電流: 最大功率耗散: 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:TQFN-38 封裝:Tube
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