4/4
REV. E
0.01
0.1
1
10
100
0
50
100
150
200
IOUT[mA]
ESR
[
]
ES
R
[Ω
]
○ Operation Notes
1.) Absolute maximum ratings
Use of the IC in excess of absolute maximum ratings (such as the input voltage or operating temperature range) may result
in damage to the IC. Assumptions should not be made regarding the state of the IC (e.g., short mode or open mode) when such
damage is suffered. If operational values are expected to exceed the maximum ratings for the device, consider adding protective
circuitry (such as fuses) to eliminate the risk of damaging the IC.
2.) GND potential
The potential of the GND pin must be the minimum potential in the system in all operating conditions.
Never connect a potential
lower than GND to any pin, even if only transiently.
3.) Thermal design
Use a thermal design that allows for a sufficient margin for that package power dissipation rating (Pd) under actual operating
conditions.
4.) Inter-pin shorts and mounting errors
Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting or shorts between
pins may result in damage to the IC.
5.) Operation in strong electromagnetic fields
Strong electromagnetic fields may cause the IC to malfunction. Caution should be exercised in applications where strong
electromagnetic fields may be present.
6.) Common impedance
Wiring traces should be as short and wide as possible to minimize common impedance. Bypass capacitors should be use to keep
ripple to a minimum.
7.) Voltage of STBY pin
To enable standby mode for all channels, set the STBY pin to 0.3 V or less, and for normal operation, to 1.2 V or more.
Setting
STBY to a voltage between 0.3 and 1.2 V may cause malfunction and should be avoided.
Keep transition time between high and
low (or vice versa) to a minimum.
Additionally, if STBY is shorted to VIN, the IC will switch to standby mode and disable the output discharge circuit, causing
a temporary voltage to remain on the output pin.
If the IC is switched on again while this voltage is present, overshoot
may occur on the output.
Therefore, in applications where these pins are shorted, the output should always be completely
discharged before turning the IC on.
8.) Over-current protection circuit (OCP)
This IC features an integrated over-current and short-protection circuitry on the output to prevent destruction of the IC
when the output is shorted.
The OCP circuitry is designed only to protect the IC from irregular conditions (such as motor
output shorts) and is not designed to be used as an active security device for the application.
Therefore, applications should
not be designed under the assumption that this circuitry will engage.
9.) Thermal shutdown circuit (TSD)
This IC also features a thermal shutdown circuit that is designed to turn the output off when the junction temperature of
the IC exceeds about 150℃.
This feature is intended to protect the IC only in the event of thermal overload and is not designed
to guarantee operation or act as an active security device for the application.
Therefore, applications should not be designed
under the assumption that this circuitry will engage.
10.) Input/output capacitor
Capacitors must be connected between the input/output pins and GND
for stable operation, and should be physically mounted as
close to
the IC pins as possible (refer to figure 4).
The input capacitor
helps to counteract increases in power supply impedance, and
increases stability in applications with long or winding power supply
traces.
The output capacitance value is directly related to the
overall stability and transient response of the regulator, and should
be set to the largest possible value for the application to increase
these characteristics. During design, keep in mind that in general,
ceramic capacitors have a wide range of tolerances, temperature
coefficients and DC bias characteristics, and that their capacitance
values tend to decrease over time. Confirm these details before
choosing appropriate capacitors for your application.(Please refer
the technical note, regarding ceramic capacitor of
recommendation)
Fig.4 Stable region (example)
Cout=0.47μF
Cin=0.47μF
Temp=+25℃
Stable region
IOUT[mA]
Unstable region