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參數(shù)資料
| 型號(hào)： | BU-64840B3-E02 |
| 廠商： | DATA DEVICE CORP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, PBGA324 |
| 封裝： | BGA-324 |
| 文件頁(yè)數(shù)： | 4/4頁(yè) |
| 文件大?。?/td> | 683K |
| 代理商： | BU-64840B3-E02 |
DATA DEVICE CORPORATION
REGISTERED TO ISO 9001:2000
FILE NO. A5976
R
E
GIS
TERED F
IR
M
U
REV 8 - 7/08 - 0
PRINTED IN THE U.S.A.
The information in this product brief is believed to be accurate; however,
no responsibility is assumed by Data Device Corporation for its use,
and no license or rights are granted by implication or otherwise in
connection therewith. Specifications are subject to change without notice.
105 Wilbur Place, Bohemia, New York, U.S.A. 11716-2426
For Technical Support - 1-800-DDC-5757 ext. 7771
Headquarters, N.Y., U.S.A. - Tel: (631) 567-5600, Fax: (631) 567-7358
United Kingdom - Tel: +44-(0)1635-811140, Fax: +44-(0)1635-32264
France - Tel: +33-(0)1-41-16-3424, Fax: +33-(0)1-41-16-3425
Germany - Tel: +49-(0)89-15- 0012-11, Fax: +49-(0)89-1500-12-22
Japan - Tel: +81-(0)3-3814-7688, Fax: +81-(0)3-3814-7689
www.ddc-web.com
Call DDC or visit www.ddc-web.com for a quote today:
Ordering Information
BU-64XX3X8-E0 2 (Micro-Ace TE)
Test Criteria:
2 = MIL-STD-1760 Amplitude
Process Requirements:
0 = Standard DDC Processing, no Burn-In
Temperature Grade/Data Requirements:
E = -40°C to +100°C
Voltage/Transceiver Option:
3 = +5V, rise/fall times = 100 to 300ns (-1553B)
8 = +3.3V, rise/fall times =100 to 300ns (1553B)
Package Type:
B = 324 Ball BGA
R = Lead Free 324 Ball BGA
Logic/RAM Voltage:
0 = 3.3V or 5V Logic/5V RAM (5V RAM in
BU-64860B(R)3 ONLY)
3 = 3.3 V Logic/RAM
Product Type:
BU-6474 = RT Only with 4K X 16 RAM
BU-6484 = BC/RT/MT with 4K X 16 RAM
BU-6486 = BC/RT/MT with 64K X 17 RAM
Available Micro-ACE TE Devices:
BU-64743B8 =
RT Only, 4K RAM x 16 RAM, 3.3V logic, 3.3V RAM, 3.3V
Transceiver
BU-64840B3 =
BC/RT/MT, 4K RAM X 16 RAM, 3 or 5V logic, 5V
transceiver NOTE 1
BU-64860B3 =
BC/RT/MT, 64K RAM X 17 RAM, 3 or 5V logic,
5V RAM, 5V transceiver
BU-64860R3 =
Lead Free BC/RT/MT, 64K RAM X 17 RAM, 3 or 5V
logic, 5V RAM, 5V Transceiver
BU-64843B8 =
BC/RT/MT, 4K RAM X 16 RAM, 3.3V logic,
3.3V transceiver NOTE 1
BU-64843R8 =
Lead Free BC/RT/MT, 4K RAM X 16 RAM, 3.3V logic,
3.3V transceiver NOTE 1
BU-64863B8 =
BC/RT/MT, 64K RAM X 17 RAM, 3.3V logic
and RAM, 3.3V transceiver
BU-64863R8 =
Lead Free BC/RT/MT, 64K RAM X 17 RAM, 3.3V logic
and RAM, 3.3V transceiver
NOTE 1: See Application Note 37 for operating these devices in Simple System RT mode
BU-61XX0X3-202 (Micro-Ace)
Test Criteria:
2 = MIL-STD-1760 Amplitude Compliant
Process Requirements:
0 = Standard DDC Processing, no Burn-In
Temperature Grade**/Data Requirements:
2 = -40°C to +85°C
Voltage/Transceiver Option:
3 = +5 volt, rise/fall times = 100 to 300 ns
(-1553B)
Package Type:
B = 128 Ball BGA
R = Lead Free 128 Ball BGA
Logic/RAM Voltage:
0 = 3.3 V or 5.0V Logic
Product Type:
BU-6174 = RT-only with 4K X 16 RAM
BU-6184 = BC/RT/MT with 4K X 16 RAM
BU-6181 = BC/RT-MT with 64K X 17 RAM
** Temperature Range applies to ball temperature
BU-65XX3X8 -E0 2 (PCI Micro-Ace TE)
Test Criteria:
2 = MIL-STD-1760 Amplitude
Process Requirements:
0 = Standard DDC Processing,
no Burn-In
Temperature Grade/Data Requirements:
E = -40°C to +100°C
Voltage/Transceiver Option:
8 = +3.3V, rise/fall times =
100 to 300 ns (-1553B)
3 = +5V, rise/fall times =
100 to 300 ns (-1553B)
Package Type:
B = 324 Ball BGA
R = Lead Free 324 Ball BGA
Logic/RAM Voltage:
3 = 3.3V Logic/RAM
4 = 3.3V Logic/5V RAM
Product Type:
BU-6584 = PCI BC/RT/MT with
4K X 16 RAM
BU-6586 = PCI BC/RT/MT with
64K X 17 RAM
Available PCI Micro-ACE TE Devices:
BU-65843B3 =
BC/RT/MT, 4K RAM X 16 RAM, 3.3V Logic
and RAM, 5V transceiver
BU-65864B3 =
BC/RT/MT, 64K RAM X 17 RAM, 3.3V Logic and
5V RAM, 5V transceiver
BU-65864R3 =
Lead Free BC/RT/MT, 64K RAM X 17 RAM, 3.3V
Logic and 5V RAM, 5V transceiver
BU-65843B8 =
BC/RT/MT, 4K RAM X 16 RAM, 3.3V Logic
and RAM, 3.3V transceiver
BU-65863B8 =
BC/RT/MT, 64K RAM X 17 RAM, 3.3V logic
and RAM, 3.3V transceiver
BU-61860B3-601
-ACE (128-ball BGA) mechanical sample,
with “daisy chain” connections of alternating
balls for use in environmental
(mechanical/thermal) integrity of testing.
ORDERING INFORMATION for Daisy Chain Mechanical Sample:
BU-64863B8-600
Micro-ACE TE 324 Ball BGA Daisy Chain
Mechanical Sample, ball pairs internally
wired, fully populated with silicon die.
Unless otherwise specified these products contain tin lead solder
4
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